PIC18CXX2_13 Datasheet, PDF (282/304 Pages) Microchip Technology – High Performance Microcontrollers with 10-bit A/D

PIC18CXX2
28-Lead Ceramic Dual In-line with Window (JW) – 600 mil (CERDIP)
Note: For the most current package drawings, please see the Microchip Packaging Specification located
at http://www.microchip.com/packaging
E1
W
D
2
n
1
E
A
c
eB
A1
A2
L
B1
B
p
Units
Dimension Limits
Number of Pins
n
Pitch
p
Top to Seating Plane
A
Ceramic Package Height
A2
Standoff
A1
Shoulder to Shoulder Width
E
Ceramic Pkg. Width
E1
Overall Length
D
Tip to Seating Plane
L
Lead Thickness
c
Upper Lead Width
B1
Lower Lead Width
B
Overall Row Spacing
§
eB
Window Diameter
W
* Controlling Parameter
§ Significant Characteristic
JEDEC Equivalent: MO-103
Drawing No. C04-013
MIN
.195
.155
.015
.595
.514
1.430
.125
.008
.050
.016
.610
.270
INCHES*
NOM
28
.100
.210
.160
.038
.600
.520
1.460
.138
.010
.058
.020
.660
.280
MAX
.225
.165
.060
.625
.526
1.490
.150
.012
.065
.023
.710
.290
MILLIMETERS
MIN
NOM
28
2.54
4.95
5.33
3.94
4.06
0.38
0.95
15.11
15.24
13.06
13.21
36.32
37.08
3.18
3.49
0.20
0.25
1.27
1.46
0.41
0.51
15.49
16.76
6.86
7.11
MAX
5.72
4.19
1.52
15.88
13.36
37.85
3.81
0.30
1.65
0.58
18.03
7.37
DS39026D-page 282
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