EP3C5E144C8N Datasheet, PDF (24/348 Pages) Altera Corporation – Ability to disable external JTAG port

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Chapter 1: Cyclone III Device Family Overview
Reference and Ordering Information
Reference and Ordering Information
Figure 1–1 and Figure 1–2 show the ordering codes for Cyclone III and Cyclone III LS
devices.
Figure 1–1. Cyclone III Device Packaging Ordering Information
Package Type
E : Plastic Enhanced Quad Flat Pack (EQFP)
Q : Plastic Quad Flat Pack (PQFP)
F : FineLine Ball-Grid Array (FBGA)
U : Ultra FineLine Ball-Grid Array (UBGA)
M : Micro FineLine Ball-Grid Array (MBGA)
Operating Temperature
C : Commercial temperature (T_J = 0° C to 85° C)
I : Industrial temperature (T_J = -40° C to 100° C)
A : Automotive temperature (T_J = -40° C to 125° C)
Family Signature
EP3C 25 F 324 C 7 N
Optional Suffix
EP3C : Cyclone III
Indicates specific device
options or shipment method
Member Code
Package Code
N : Lead-free packaging
5 : 5,136 logic elements
144 : 144 pins
ES : Engineering sample
10 : 10,320 logic elements
16 : 15,408 logic elements
164 : 164 pins
240 : 240 pins
Speed Grade
25 : 24,624 logic elements
256 : 256 pins
6 (fastest)
25E : 24,624 logic elements
324 : 324 pins
7
40 : 39,600 logic elements
780 : 780 pins
8
55 : 55,856 logic elements
80 : 81,264 logic elements
120 : 119,088 logic elements
Figure 1–2. Cyclone III LS Device Packaging Ordering Information
Package Type
F : FineLine Ball-Grid Array (FBGA)
U : Ultra FineLine Ball-Grid Array (UBGA)
Operating Temperature
C : Commercial temperature (T_J = 0° C to 85° C)
I : Industrial temperature (T_J = -40° C to 100° C)
Family Signature
EP3CLS 70 F 484 C 7 N
Optional Suffix
EP3CLS : Cyclone III LS
Indicates specific device
options or shipment method
Member Code
Package Code
N : Lead-free packaging
70 : 70,208 logic elements
484 : 484 pins
ES : Engineering sample
100 : 100,448 logic elements
150 : 150,848 logic elements
780 : 780 pins
Speed Grade
200 : 198,464 logic elements
7 (fastest)
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Cyclone III Device Handbook
Volume 1
December 2011 Altera Corporation