LM3S5G31 Datasheet, PDF (10/1223 Pages) Texas Instruments – Stellaris LM3S5G31 Microcontroller

Table of Contents
23.3 Connections for Unused Signals ................................................................................. 1142
24 Operating Characteristics ................................................................................. 1144
25 Electrical Characteristics .................................................................................. 1145
25.1 Maximum Ratings ...................................................................................................... 1145
25.2 Recommended Operating Conditions ......................................................................... 1145
25.3 Load Conditions ........................................................................................................ 1146
25.4 JTAG and Boundary Scan .......................................................................................... 1146
25.5 Power and Brown-Out ............................................................................................... 1148
25.6 Reset ........................................................................................................................ 1149
25.7 On-Chip Low Drop-Out (LDO) Regulator ..................................................................... 1150
25.8 Clocks ...................................................................................................................... 1150
25.8.1 PLL Specifications ..................................................................................................... 1150
25.8.2 PIOSC Specifications ................................................................................................ 1151
25.8.3 Internal 30-kHz Oscillator Specifications ..................................................................... 1151
25.8.4 Hibernation Clock Source Specifications ..................................................................... 1152
25.8.5 Main Oscillator Specifications ..................................................................................... 1152
25.8.6 System Clock Specification with ADC Operation .......................................................... 1153
25.8.7 System Clock Specification with USB Operation .......................................................... 1153
25.9 Sleep Modes ............................................................................................................. 1153
25.10 Hibernation Module ................................................................................................... 1154
25.11 Flash Memory ........................................................................................................... 1155
25.12 Input/Output Characteristics ....................................................................................... 1155
25.13 External Peripheral Interface (EPI) .............................................................................. 1156
25.14 Analog-to-Digital Converter (ADC) .............................................................................. 1162
25.15 Synchronous Serial Interface (SSI) ............................................................................. 1163
25.16 Inter-Integrated Circuit (I²C) Interface ......................................................................... 1165
25.17 Universal Serial Bus (USB) Controller ......................................................................... 1166
25.18 Analog Comparator ................................................................................................... 1166
25.19 Current Consumption ................................................................................................. 1166
25.19.1 Nominal Power Consumption ..................................................................................... 1166
25.19.2 Maximum Current Consumption ................................................................................. 1167
A Register Quick Reference ................................................................................. 1169
B Ordering and Contact Information ................................................................... 1210
B.1 Ordering Information .................................................................................................. 1210
B.2 Part Markings ............................................................................................................ 1210
B.3 Kits ........................................................................................................................... 1210
B.4 Support Information ................................................................................................... 1211
C
C.1
C.1.1
C.1.2
C.1.3
C.2
C.2.1
C.2.2
C.2.3
Package Information .......................................................................................... 1212
100-Pin LQFP Package ............................................................................................. 1212
Package Dimensions ................................................................................................. 1212
Tray Dimensions ....................................................................................................... 1214
Tape and Reel Dimensions ........................................................................................ 1214
108-Ball BGA Package .............................................................................................. 1216
Package Dimensions ................................................................................................. 1216
Tray Dimensions ....................................................................................................... 1218
Tape and Reel Dimensions ........................................................................................ 1219
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July 03, 2014
Texas Instruments-Production Data