MC9S08RG60 Datasheet, PDF (228/232 Pages) Motorola, Inc – Microcontrollers

Ordering Information and Mechanical Drawings
D.2.4 44-Pin LQFP Package Drawing
4X
0.2 (0.008) H L-M N ^{4X 11 TIPS}
0.2 (0.008) T L-M N
-X-
PLATING
X=L, M, N
BASE METAL
F
-L-
C
-H-
-T-
SEATING
PLANE
44
1
3X VIEW Y
34
33
-M-
CL
AB
AB
BV
40X G
VIEW Y
J
U
D
0.20 (0.008) ^M T L-M ^S N ^S
SECTION AB-AB
ROTATED 90_° CLOCKWISE
11
12
A1
S1
B1
V1
23
22
-N-
A
S
4X (q2)
VIEW AA
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DATUM PLANE -H- IS LOCATED AT BOTTOM OF LEAD
AND IS COINCIDENT WITH THE LEAD WHERE THE
LEAD EXITS THE PLASTIC BODY AT THE BOTTOM OF
THE PARTING LINE.
4. DATUMS -L-, -M- AND -N- TO BE DETERMINED AT
DATUM PLANE -H-.
5. DIMENSIONS S AND V TO BE DETERMINED AT
SEATING PLANE -T-.
6. DIMENSIONS A AND B DO NOT INCLUDE MOLD
PROTRUSION. ALLOWABLE PROTRUSION IS 0.25
(0.010) PER SIDE. DIMENSIONS A AND B DO INCLUDE
MOLD MISMATCH AND ARE DETERMINED AT DATUM
PLANE -H-.
7. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. DAMBAR PROTRUSION SHALL NOT
CAUSE THE D DIMENSION TO EXCEED 0.53 (0.021).
MINIMUM SPACE BETWEEN PROTRUSION AND
ADJACENT LEAD OR PROTRUSION 0.07 (0.003).
0.1 (0.004) T
4X (q3)
C2
0.05 (0.002) S
(W)
q1
2X R R1
0.25 (0.010)
GAGE PLANE
(K)
C1
E
q
(Z)
VIEW AA
MILLIMETERS
INCHES
DIM MIN MAX MIN MAX
A 10.00 BSC
0.394 BSC
A1 5.00 BSC
0.197 BSC
B 10.00 BSC
0.394 BSC
B2 5.00 BSC
0.197 BSC
C
--- 1.60
--- 0.063
C1 0.05 0.15 0.002 0.006
C2 1.35 1.45 0.053 0.057
D 0.30 0.45 0.012 0.018
E 0.45 0.75 0.018 0.030
F 0.30 0.40 0.012 0.016
G
0.80 BSC
0.031 BSC
J 0.09 0.20 0.004 0.008
K
0.50 REF
0.020 REF
R1 0.09 0.20 0.004 0.008
S 12.00 BSC
0.472 BSC
S1 6.00 BSC
0.236 BSC
U 0.09 0.16 0.004 0.006
V 12.00 BSC
0.472 BSC
V1 6.00 BSC
0.236 BSC
W
0.20 REF
0.008 REF
Z
1.00 REF
0.039 REF
q 0_° 7_° 0_° 7_°
q1
0 _° ---
0_°
---
q2
12_° REF
12_° REF
q3
12° REF
12° REF
CASE 824D-02
ISSUE A
DATE 08/09/95
228
MC9S08RC/RD/RE/RG
Freescale Semiconductor