MC9S08RG60 Datasheet, PDF (224/232 Pages) Motorola, Inc – Microcontrollers

Ordering Information and Mechanical Drawings
Table 14-4 Orderable Part Numbers (Continued)
MC Order Number
FLASH
Memory
RAM
ACMP
SCI
MC9S08RD32(C)FG
32K
2K
No
Yes
MC9S08RD60(C)PE
60K
2K
No
Yes
MC9S08RD60(C)DWE
60K
2K
No
Yes
MC9S08RD60(C)FJ
60K
2K
No
Yes
MC9S08RD60(C)FG
60K
2K
No
Yes
MC9S08RC8(C)FJ
8K
1K
Yes
No
MC9S08RC8(C)FG
8K
1K
Yes
No
MC9S08RC16(C)FJ
16K
1K
Yes
No
MC9S08RC16(C)FG
16K
1K
Yes
No
MC9S08RC32(C)FJ
32K
2K
Yes
No
MC9S08RC32(C)FG
32K
2K
Yes
No
MC9S08RC60(C)FJ
60K
2K
Yes
No
MC9S08RC60(C)FG
60K
2K
Yes
No
SPI
Available Package Type
(Part Number Suffix)
No
44 LQFP (FG)
No
28 PDIP (P)
No
28 SOIC (DW)
No
32 LQFP (FJ)
No
44 LQFP (FG)
No
32 LQFP (FJ)
No
44 LQFP (FG)
No
32 LQFP (FJ)
No
44 LQFP (FG)
No
32 LQFP (FJ)
No
44 LQFP (FG)
No
32 LQFP (FJ)
No
44 LQFP (FG)
Package designators:
DW =28-pin Small Outline Integrated Circuit (SOIC)
P = 28-pin Plastic Dual In-Line Package (PDIP)
FG = 44-pin Low Quad Flat Package (LQFP)
FJ = 32-pin Low Quad Flat Package (LQFP)
Status
Memory
Type
Core
Family
MC 9 S08 RG60 (C) XX E
Indicates lead-free packag
Package designator
Temperature range
designator
C = –40 thru 85°C
Blank = 0 thru 70°C
D.2 Mechanical Drawings
This appendix contains mechanical specification for MC9S08RC/RD/RE/RG MCU.
224
MC9S08RC/RD/RE/RG
Freescale Semiconductor