MC9S08RG60 Datasheet, PDF (227/232 Pages) Motorola, Inc – Microcontrollers

D.2.3 32-Pin LQFP Package Drawing
SoC Guide — MC9S08RG60/D Rev 1.10
A
A1
32
4X
0.20 (0.008) AB T-U Z
25
1
-T-
B
B1
8
DETAIL Y
-U-
V
17 ^V1
9
-Z-
4X
9
S1
0.20 (0.008) AC T-U Z
S
-AB-
SEATING
PLANE
-AC-
8X M
CE
DETAIL AD
G
0.10 (0.004) AC
R
BASE
METAL
N
F
D
J
SECTION AE-AE
W
H
KQ
X
DETAIL AD
CASE 873A-02
ISSUE A
AE
P
AE
DETAIL Y
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DATUM PLANE -AB- IS LOCATED AT BOTTOM OF LEAD
AND IS COINCIDENT WITH THE LEAD WHERE THE
LEAD EXITS THE PLASTIC BODY AT THE BOTTOM OF
THE PARTING LINE.
4. DATUMS -T-, -U-, AND -Z- TO BE DETERMINED AT
DATUM PLANE -AB-.
5. DIMENSIONS S AND V TO BE DETERMINED AT
SEATING PLANE -AC-.
6. DIMENSIONS A AND B DO NOT INCLUDE MOLD
PROTRUSION. ALLOWABLE PROTRUSION IS 0.250
(0.010) PER SIDE. DIMENSIONS A AND B DO INCLUDE
MOLD MISMATCH AND ARE DETERMINED AT DATUM
PLANE -AB-.
7. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. DAMBAR PROTRUSION SHALL NOT
CAUSE THE D DIMENSION TO EXCEED 0.520 (0.020).
8. MINIMUM SOLDER PLATE THICKNESS SHALL BE
0.0076 (0.0003).
9. EXACT SHAPE OF EACH CORNER MAY VARY FROM
DEPICTION.
MILLIMETERS
INCHES
DIM MIN MAX MIN MAX
A 7.000 BSC
0.276 BSC
A1 3.500 BSC
0.138 BSC
B 7.000 BSC
0.276 BSC
B1 3.500 BSC
0.138 BSC
C 1.400 1.600 0.055 0.063
D 0.300 0.450 0.012 0.018
E 1.350 1.450 0.053 0.057
F 0.300 0.400 0.012 0.016
G 0.800 BSC
0.031 BSC
H 0.050 0.150 0.002 0.006
J 0.090 0.200 0.004 0.008
K 0.500 0.700 0.020 0.028
M
12_ REF
12_ REF
N 0.090 0.160 0.004 0.006
P 0.400 BSC
0.016 BSC
Q
1_
5 _ 1_
5_
R 0.150 0.250 0.006 0.010
S 9.000 BSC
0.354 BSC
S1 4.500 BSC
0.177 BSC
V 9.000 BSC
0.354 BSC
V1 4.500 BSC
0.177 BSC
W 0.200 REF
0.008 REF
X
1.000 REF
0.039 REF
DATE 12/16/93
Freescale Semiconductor
MC9S08RC/RD/RE/RG
227