MC9S08RG60 Datasheet, PDF (225/232 Pages) Motorola, Inc – Microcontrollers

D.2.1 28-Pin SOIC Package Drawing
SoC Guide — MC9S08RG60/D Rev 1.10
A
28
D
15
1
B
14
PIN 1 IDENT
e
B
0.025 M C A S B S
0.10
C
SEATING
PLANE
NOTES:
1. DIMENSIONS ARE IN MILLIMETERS.
2. INTERPRET DIMENSIONS AND TOLERANCES PER
ASME Y14.5M, 1994.
3. DIMENSIONS D AND E DO NOT INCLUDE MOLD
PROTRUSIONS.
4. MAXIMUM MOLD PROTRUSION 0.015 PER SIDE.
5. DIMENSION B DOES NOT INCLUDE DAMBAR PRO-
TRUSION. ALLOWABLE DAMBAR PROTRUSION
SHALL BE 0.13 TOTAL IN EXCESS OF B DIMENSION
AT MAXIMUM MATERIAL CONDITION.
MILLIMETERS
DIM MIN MAX
A 2.35 2.65
A1 0.13 0.29
B 0.35 0.49
C 0.23 0.32
L
D 17.80 18.05
E 7.40 7.60
e 1.27 BSC
H 10.05 10.55
C
L 0.41 0.90
q 0_{_} 8_{_}
q
CASE 751F-05
ISSUE F
DATE 05/27/97
Freescale Semiconductor
MC9S08RC/RD/RE/RG
225