PIC18FXX8 Datasheet, PDF (337/402 Pages) Microchip Technology – 28/40-Pin High-Performance, Enhanced Flash Microcontrollers with CAN Module

PIC18FXX8
27.1 DC Characteristics (Continued)
PIC18LFXX8
(Industrial)
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C ≤ TA ≤ +85°C for industrial
PIC18FXX8
(Industrial, Extended)
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C ≤ TA ≤ +85°C for industrial
-40°C ≤ TA ≤ +125°C for extended
Param
No.
Symbol
Characteristic/
Device
Min Typ Max Units
Conditions
∆IWDT Module Differential Current
D022
Watchdog Timer —
PIC18LFXX8 —
—
0.75 1.5
0.8 8
7 25
µA VDD = 2.5V, +25°C
µA VDD = 2.0V, -40°C to +85°C
µA VDD = 4.2V, -40°C to +85°C
D022
D022A ∆IBOR
D022A
D022B ∆ILVD
D022B
Watchdog Timer — 7 25 µA VDD = 4.2V, +25°C
PIC18FXX8 — 7 25 µA VDD = 4.2V, -40°C to +85°C
— 7 45 µA VDD = 4.2V, -40°C to +125°C
Brown-out Reset⁽⁵⁾ — 38 50 µA VDD = 2.0V, +25°C
PIC18LFXX8 — 42 55 µA VDD = 2.0V, -40°C to +85°C
— 49 65 µA VDD = 4.2V, -40°C to +85°C
Brown-out Reset⁽⁵⁾ — 46 65 µA VDD = 4.2V, +25°C
PIC18FXX8 — 49 65 µA VDD = 4.2V, -40°C to +85°C
— 50 75 µA VDD = 4.2V, -40°C to +125°C
Low-Voltage Detect⁽⁵⁾ — 36 50 µA VDD = 2.0V, +25°C
PIC18LFXX8 — 40 55 µA VDD = 2.0V, -40°C to +85°C
— 47 65 µA VDD = 4.2V, -40°C to +85°C
Low-Voltage Detect⁽⁵⁾ — 44 65 µA VDD = 4.2V, +25°C
PIC18FXX8 — 47 65 µA VDD = 4.2V, -40°C to +85°C
— 47 75 µA VDD = 4.2V, -40°C to +125°C
D025 ∆ITMR1
Timer1 Oscillator — 6.2 40 µA VDD = 2.0V, +25°C
PIC18LFXX8 — 6.2 45 µA VDD = 2.0V, -40°C to +85°C
— 7.5 55 µA VDD = 4.2V, -40°C to +85°C
D025
Timer1 Oscillator — 7.5 55 µA VDD = 4.2V, +25°C
PIC18FXX8 — 7.5 55 µA VDD = 4.2V, -40°C to +85°C
— 7.5 65 µA VDD = 4.2V, -40°C to +125°C
Legend: Rows are shaded for improved readability.
Note 1: This is the limit to which VDD can be lowered in Sleep mode, or during a device Reset, without losing RAM
data.
2: The supply current is mainly a function of the operating voltage and frequency. Other factors, such as I/O
pin loading and switching rate, oscillator type, internal code execution pattern and temperature, also have
an impact on the current consumption.
The test conditions for all IDD measurements in active operation mode are:
OSC1 = external square wave, from rail-to-rail; all I/O pins tri-stated, pulled to VDD
MCLR = VDD; WDT enabled/disabled as specified.
3: The power-down current in Sleep mode does not depend on the oscillator type. Power-down current is
measured with the part in Sleep mode, with all I/O pins in high-impedance state and tied to VDD and VSS
and all features that add delta current disabled (such as WDT, Timer1 Oscillator, BOR, ...).
4: For RC oscillator configuration, current through REXT is not included. The current through the resistor can
be estimated by the formula Ir = VDD/2 REXT (mA) with REXT in kOhm.
5: The LVD and BOR modules share a large portion of circuitry. The ∆IBOR and ∆ILVD currents are not
additive. Once one of these modules is enabled, the other may also be enabled without further penalty.
 2004 Microchip Technology Inc.
DS41159D-page 335