PIC18FXX8 Datasheet, PDF (336/402 Pages) Microchip Technology – 28/40-Pin High-Performance, Enhanced Flash Microcontrollers with CAN Module

PIC18FXX8
27.1 DC Characteristics (Continued)
PIC18LFXX8
(Industrial)
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C ≤ TA ≤ +85°C for industrial
PIC18FXX8
(Industrial, Extended)
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C ≤ TA ≤ +85°C for industrial
-40°C ≤ TA ≤ +125°C for extended
Param
No.
Symbol
Characteristic/
Device
Min Typ Max Units
Conditions
IDD
Supply Current^(2,3,4)
D010C
PIC18LFXX8
EC, ECIO oscillator configurations
— 21 28 mA VDD = 4.2V, -40°C to +85°C
D010C
PIC18FXX8
EC, ECIO oscillator configurations
— 21 30 mA VDD = 4.2V, -40°C to +125°C,
FOSC = 25 MHz
D013
PIC18LFXX8
HS oscillator configurations
— 1.3 3 mA FOSC = 6 MHz, VDD = 2.0V
— 18 28 mA FOSC = 25 MHz, VDD = 5.5V
HS + PLL osc configuration
— 28 40 mA FOSC = 10 MHz, VDD = 5.5V
D013
PIC18FXX8
HS oscillator configurations
— 18 28 mA FOSC = 25 MHz, VDD = 5.5V
HS + PLL osc configuration
— 28 40 mA FOSC = 10 MHz, VDD = 5.5V
D014
PIC18LFXX8
Timer1 oscillator configuration
— 32 65 µA FOSC = 32 kHz, VDD = 2.0V
D014
IPD
PIC18FXX8
—
—
Power-Down Current⁽³⁾
Timer1 oscillator configuration
62 250 µA FOSC = 32 kHz, VDD = 4.2V, -40°C to +85°C
62 310 µA FOSC = 32 kHz, VDD = 4.2V, -40°C to +125°C
D020
PIC18LFXX8
— 0.3 4 µA VDD = 2.0V, -40°C to +85°C
— 2 10 µA VDD = 4.2V, -40°C to +85°C
D020
PIC18FXX8 — 2 10 µA VDD = 4.2V, -40°C to +85°C
D021B
— 6 40 µA VDD = 4.2V, -40°C to +125°C
Legend: Rows are shaded for improved readability.
Note 1: This is the limit to which VDD can be lowered in Sleep mode, or during a device Reset, without losing RAM
data.
2: The supply current is mainly a function of the operating voltage and frequency. Other factors, such as I/O
pin loading and switching rate, oscillator type, internal code execution pattern and temperature, also have
an impact on the current consumption.
The test conditions for all IDD measurements in active operation mode are:
OSC1 = external square wave, from rail-to-rail; all I/O pins tri-stated, pulled to VDD
MCLR = VDD; WDT enabled/disabled as specified.
3: The power-down current in Sleep mode does not depend on the oscillator type. Power-down current is
measured with the part in Sleep mode, with all I/O pins in high-impedance state and tied to VDD and VSS
and all features that add delta current disabled (such as WDT, Timer1 Oscillator, BOR, ...).
4: For RC oscillator configuration, current through REXT is not included. The current through the resistor can
be estimated by the formula Ir = VDD/2 REXT (mA) with REXT in kOhm.
5: The LVD and BOR modules share a large portion of circuitry. The ∆IBOR and ∆ILVD currents are not
additive. Once one of these modules is enabled, the other may also be enabled without further penalty.
DS41159D-page 334
 2004 Microchip Technology Inc.