PIC18FXX8 Datasheet, PDF (335/402 Pages) Microchip Technology – 28/40-Pin High-Performance, Enhanced Flash Microcontrollers with CAN Module

PIC18FXX8
27.1 DC Characteristics (Continued)
PIC18LFXX8
(Industrial)
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C ≤ TA ≤ +85°C for industrial
PIC18FXX8
(Industrial, Extended)
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C ≤ TA ≤ +85°C for industrial
-40°C ≤ TA ≤ +125°C for extended
Param
No.
Symbol
Characteristic/
Device
Min Typ Max Units
Conditions
IDD
Supply Current^(2,3,4)
D010
PIC18LFXX8
XT oscillator configuration
— .7 2 mA VDD = 2.0V, +25°C, FOSC = 4 MHz
— .7 2 mA VDD = 2.0V, -40°C to +85°C, FOSC = 4 MHz
— 1.7 4 mA VDD = 4.2V, -40°C to +85°C, FOSC = 4 MHz
RC oscillator configuration
— 1 2.5 mA VDD = 2.0V, +25°C, FOSC = 4 MHz
— 1 2.5 mA VDD = 2.0V, -40°C to +85°C, FOSC = 4 MHz
— 2.5 5 mA VDD = 4.2V, -40°C to +85°C, FOSC = 4 MHz
RCIO oscillator configuration
— .7 2.5 mA VDD = 2.0V, +25°C, FOSC = 4 MHz
— .7 2.5 mA VDD = 2.0V, -40°C to +85°C, FOSC = 4 MHz
— 1.8 4 mA VDD = 4.2V, -40°C to +85°C, FOSC = 4 MHz
D010
PIC18FXX8
XT oscillator configuration
— 1.7 4 mA VDD = 4.2V, +25°C, FOSC = 4 MHz
— 1.7 4 mA VDD = 4.2V, -40°C to +85°C, FOSC = 4 MHz
— 1.7 4 mA VDD = 4.2V, -40°C to +125°C, FOSC = 4 MHz
RC oscillator configuration
— 2.5 5 mA VDD = 4.2V, +25°C, FOSC = 4 MHz
— 2.5 5 mA VDD = 4.2V, -40°C to +85°C, FOSC = 4 MHz
— 2.5 6 mA VDD = 4.2V, -40°C to +125°C, FOSC = 4 MHz
RCIO oscillator configuration
— 1.8 4 mA VDD = 4.2V, +25°C, FOSC = 4 MHz
— 1.8 5 mA VDD = 4.2V, -40°C to +85°C, FOSC = 4 MHz
— 1.8 5 mA VDD = 4.2V, -40°C to +125°C, FOSC = 4 MHz
D010A
PIC18LFXX8
LP oscillator, FOSC = 32 kHz, WDT disabled
— 18 40 µA VDD = 2.0V, -40°C to +85°C
D010A
PIC18FXX8
—
—
LP oscillator, FOSC = 32 kHz, WDT disabled
60 150 µA VDD = 4.2V, -40°C to +85°C
60 180 µA VDD = 4.2V, -40°C to +125°C
Legend: Rows are shaded for improved readability.
Note 1: This is the limit to which VDD can be lowered in Sleep mode, or during a device Reset, without losing RAM
data.
2: The supply current is mainly a function of the operating voltage and frequency. Other factors, such as I/O
pin loading and switching rate, oscillator type, internal code execution pattern and temperature, also have
an impact on the current consumption.
The test conditions for all IDD measurements in active operation mode are:
OSC1 = external square wave, from rail-to-rail; all I/O pins tri-stated, pulled to VDD
MCLR = VDD; WDT enabled/disabled as specified.
3: The power-down current in Sleep mode does not depend on the oscillator type. Power-down current is
measured with the part in Sleep mode, with all I/O pins in high-impedance state and tied to VDD and VSS
and all features that add delta current disabled (such as WDT, Timer1 Oscillator, BOR, ...).
4: For RC oscillator configuration, current through REXT is not included. The current through the resistor can
be estimated by the formula Ir = VDD/2 REXT (mA) with REXT in kOhm.
5: The LVD and BOR modules share a large portion of circuitry. The ∆IBOR and ∆ILVD currents are not
additive. Once one of these modules is enabled, the other may also be enabled without further penalty.
 2004 Microchip Technology Inc.
DS41159D-page 333