PIC18F258 Datasheet, PDF (330/384 Pages) Microchip Technology – High Performance, 28/40-Pin Enhanced FLASH Microcontrollers with CAN

PIC18FXX8
27.1 DC Characteristics (Continued)
PIC18LFXX8
(Industrial)
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C ≤ TA ≤ +85°C for industrial
PIC18FXX8
(Industrial, Extended)
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C ≤ TA ≤ +85°C for industrial
-40°C ≤ TA ≤ +125°C for extended
Param
No.
Symbol
Characteristic/
Device
Min Typ⁽⁵⁾ Max Units
Conditions
IDD
Supply Current^(2,3,4)
D010
PIC18LFXX8
—
XT, RC, RCIO osc configurations
1 TBD mA FOSC = 4 MHz, VDD = 2.0V
D010
PIC18FXX8
—
XT, RC, RCIO osc configurations
2 TBD mA FOSC = 4 MHz, VDD = 4.2V
D010A
PIC18LFXX8
—
LP osc configuration
30 TBD µA FOSC = 32 kHz, VDD = 2.0V
D010A
PIC18FXX8
LP osc configuration
— 185 TBD µA FOSC = 32 kHz, VDD = 4.2V
D010C
PIC18LFXX8
—
EC, ECIO osc configurations,
22 TBD mA FOSC = 40 MHz, VDD = 5.5V
D010C
PIC18FXX8
—
EC, ECIO osc configurations,
22 TBD mA FOSC = 40 MHz, VDD = 5.5V
D013
PIC18LFXX8
—
—
—
HS osc configurations
1.4 TBD mA FOSC = 6 MHz, VDD = 2.5V
14 TBD mA FOSC = 25 MHz, VDD = 5.5V
HS + PLL osc configuration
22 TBD mA FOSC = 10 MHz, VDD = 5.5V
D013
PIC18FXX8
—
—
HS osc configurations
14 TBD mA FOSC = 25 MHz, VDD = 5.5V
HS + PLL osc configuration
22 TBD mA FOSC = 10 MHz, VDD = 5.5V
D014
PIC18LFXX8
—
Timer1 osc configuration
32 TBD µA FOSC = 32 kHz, VDD = 2.5V
D014
PIC18FXX8
—
OSCB osc configuration
62 TBD µA FOSC = 32 kHz, VDD = 4.2V
Legend: Rows are shaded for improved readability.
Note 1: This is the limit to which VDD can be lowered in SLEEP mode or during a device RESET, without losing
RAM data.
2: The supply current is mainly a function of the operating voltage and frequency. Other factors such as I/O pin
loading and switching rate, oscillator type, internal code execution pattern, and temperature also have an
impact on the current consumption.
The test conditions for all IDD measurements in Active Operation mode are:
OSC1 = external square wave, from rail-to-rail; all I/O pins tri-stated, pulled to VDD
MCLR = VDD; WDT enabled/disabled as specified.
3: The power-down current in SLEEP mode does not depend on the oscillator type. Power-down current is
measured with the part in SLEEP mode, with all I/O pins in hi-impedance state and tied to VDD and VSS,
and all features that add delta current disabled (such as WDT, Timer1 Oscillator, BOR, ...).
4: For RC osc configuration, current through REXT is not included. The current through the resistor can be
estimated by the formula Ir = VDD/2REXT (mA) with REXT in kOhm.
5: Typical is taken at 25°C.
DS41159B-page 328
Preliminary
 2002 Microchip Technology Inc.