IC61C6416 Datasheet, PDF (79/80 Pages) Integrated Circuit Solution Inc – 64K X 16 HIGH-SPEED CMOS STATIC RAM

HYB18T256324F–[16/20/22]
256-Mbit DDR SGRAM
Package Outlines
5.1
Package Thermal Characteristics
Table 47 P-FBGA 144 Package Thermal Resitances
Theta_jA
JEDEC Board
1s0p
Air Flow
0 m/s 1 m/s
3 m/s
0 m/s
K/W
48.8 40.2
35.1
27.0
2s0p
1 m/s
23.5
3 m/s
22.0
Theta_jB Theta_jC
-
-
6.0
3.9
1. Theta_jA : Junction to Ambient thermal resistance. The values have been obtained by simulation using the
conditions stated in the JEDEC JESD-51 standard.
2. Theta_jB : Junction to Board thermal resistance. The value has been obtained by simulation.
3. Theta_jC : Junction to Case thermal resistance. The value has been obtainned by simulation.
Data Sheet
79
Rev. 1.11, 04-2005
10292004-DOXT-FS0U