IC61C6416 Datasheet, PDF (78/80 Pages) Integrated Circuit Solution Inc – 64K X 16 HIGH-SPEED CMOS STATIC RAM

5
Package Outlines
11.00 ± 0.10
BALL A1
INDICATOR
HYB18T256324F–[16/20/22]
256-Mbit DDR SGRAM
Package Outlines
TOP VIEW
1.20 MAX
1 2 3 4 5 6 7 8 9 10 11 12
M
L
K
J
H
G
F
E
D
C
B
A
0.40
0.80 (11X)
BALLS VIEW
All dimensions in mm.
Figure 58 Package Outline FBGA
1. The package is conforming with JEDEC MO216
2. The inner matrix of 4x4 balls is reserved for thermal contacts
C
0.12 C
Data Sheet
78
Rev. 1.11, 04-2005
10292004-DOXT-FS0U