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IC61C6416 Datasheet, PDF (66/80 Pages) Integrated Circuit Solution Inc – 64K X 16 HIGH-SPEED CMOS STATIC RAM
HYB18T256324F–[16/20/22]
256-Mbit DDR SGRAM
Electrical Characteristics
4.2
Recommended Power & DC Operation Conditions.
All values are recommended operating conditions unless otherwise noted. Tc = 0 to 85 °C.
(0°C ≤ TC ≤ +85°C, VDD = +2.0 V ± 0.10 V, VDDQ = +2.0 V ± 0.10 V, see Table 1)
Table 33 Power & DC Operation Conditions
Parameter
Power Supply Voltage
Power Supply Voltage for I/O Buffer
Reference Voltage
Output Low Voltage
Input leakage current
CLK Input leakage current
Output leakage current
Symbol Speed
sort
VDD
VDDQ
VREF
VOL(DC)
IIL
IILC
IOL
–1.6
–2.0
–2.2
–1.6
–2.0
–2.2
–1.6
–2.0
–2.2
Limit Values
Unit Notes
min.
typ.
max.
1.9
2.0
2.1
V
1)
1.9
2.0
2.1
V
1)
1.9
2.0
2.1
V
1)
1.9
2.0
2.1
V
1)
1.9
2.0
2.1
V
1)
1.9
2.0
2.1
V
1)
0.72*VDDQ 0.73*VDDQ 0.74*VDDQ V 2)
0.72*VDDQ 0.73*VDDQ 0.74*VDDQ
2)3)
0.72*VDDQ 0.73*VDDQ 0.74*VDDQ
2)3)
0.4*VDDQ V
–5
+5
µA 4)
–5
+5
µA
–5
+5
µA 4)
1) VDDQ tracks with VDD. AC parameters are measured with VDD and VDDQ tied together.
2) VREF is allowed ± 19mV for DC error and an additionnal ± 28mV for AC noise.
3) VREF is expected to equal 73% of VDDQ for the transmitting device and to track variations in the DC level of the
same. Peak-to-peak noise on VREF may not exceed ±2% VREF (DC). Thus, from 73% of VDDQ.
4) IIL and IOL are measured with ODT disabled.
Data Sheet
66
Rev. 1.11, 04-2005
10292004-DOXT-FS0U