EP2C20F256C8N Datasheet, PDF (452/470 Pages) Altera Corporation – Cyclone II Device Handbook, Volume 1

Package Outlines
Table 15–4 provides θ_JA (junction-to-ambient thermal resistance) values,
θ_JC (junction-to-case thermal resistance) values, θ_JB (junction-to-board
thermal resistance) values for Cyclone II devices on a typical board.
Table 15–4. Thermal Resistance of Cyclone II Devices for Typical Board
Device
Pin
Count
Package
θ_{J A}
(° C/W)
Still Air
θ_{J A} (° C/W)
100 ft./min.
θ_{J A} (° C/W)
200 ft./min.
θ_{J A} (° C/W)
400 ft./min.
θ_{J C}
(° C/W)
θ_{J B}
(° C/W)
EP2C5 256 FineLine BGA
30.2
25.8
22.9
20.6
8.7
14.8
EP2C8 256 FineLine BGA
27.9
23.2
20.5
18.4
7.1
12.3
EP2C15 256 FineLine BGA
24.7
20.1
17.5
15.3
5.5
9.1
484 FineLine BGA
20.5
16.2
13.9
12.2
4.2
7.2
EP2C20 256 FineLine BGA
24.7
20.1
17.5
15.3
5.5
9.1
484 FineLine BGA
20.5
16.2
13.9
12.2
4.2
7.2
EP2C35 484 FineLine BGA
18.8
14.5
12.3
10.6
3.3
5.7
484 Ultra FineLine BGA 20
15.5
13.2
11.3
5
5.3
672 FineLine BGA
17.4
13.3
11.3
9.8
3.1
5.5
EP2C50 484 FineLine BGA
17.7
13.5
11.4
9.8
2.8
4.5
484 FineLine BGA
18.1
13.8
11.7
10.1
2.8
4.6
484 Ultra FineLine BGA 19
14.6
12.3
10.6
4.4
4.4
484 Ultra FineLine BGA 19.4
15
12.7
10.9
4.4
4.6
672 FineLine BGA
16.5
12.4
10.5
9
2.6
4.6
EP2C70 672 FineLine BGA
15.7
11.7
9.8
8.3
2.2
3.8
672 FineLine BGA
15.9
11.9
9.9
8.4
2.2
3.9
896 FineLine BGA
14.6
10.7
8.9
7.6
2.1
3.7
Package
Outlines
The package outlines on the following pages are listed in order of
ascending pin count.
144-Pin Plastic Thin Quad Flat Pack (TQFP) – Wirebond
■ All dimensions and tolerances conform to ASME Y14.5M – 1994.
■ Controlling dimension is in millimeters.
■ Pin 1 may be indicated by an ID dot, or a special feature, in its
proximity on package surface.
15–4
Cyclone II Device Handbook, Volume 1
Altera Corporation
February 2007