Z8F0113HJ005EG Datasheet, PDF (225/245 Pages) Zilog, Inc. – High-Performance 8-Bit Microcontrollers

Z8 Encore! XP^® F0823 Series
Product Specification
210
Packaging
Zilog’s F0823 Series of MCUs includes the Z8F0113, Z8F0123, Z8F0213, Z8F0223,
Z8F0413, Z8F0423, Z8F0813 and Z8F0823 devices, which are available in the following
packages:
• 8-pin Plastic Dual Inline Package (PDIP)
• 8-Pin Quad Flat No-Lead Package (QFN)/MLF-S¹
• 20-pin Plastic Dual-Inline Package (PDIP)
• 20-pin Small Outline Integrated Circuit Package (SOIC)
• 20-pin Small Shrink Outline Package (SSOP)
• 28-pin Plastic Dual-Inline Package (PDIP)
• 28-pin Small Outline Integrated Circuit Package (SOIC)
• 28-pin Small Shrink Outline Package (SSOP)
Current diagrams for each of these packages are published in Zilog’s Packaging Product
Specification (PS0072), which is available free for download from the Zilog website.
1. The footprint of the QFN)/MLF-S package is identical to that of the 8-pin SOIC package, but with a lower profile.
PS024315-1011
PRELIMINARY
Packaging