W631GG6KB-15 Datasheet, PDF (158/158 Pages) Winbond – Double Data Rate architecture: two data transfers per clock cycle

W631GG6KB
11. REVISION HISTORY
VERSION
DATE
PAGE
DESCRIPTION
A01 Mar. 02, 2012
All
Initial formally data sheet
5~7, 97, 122,
132, 134, 135, Added 12I, 12A, 12K, 15A and 15K grade parts
A02 Jun. 28, 2012 _142~145
6
Added section 3 order information table
A03 Sep. 03, 2012
158
Remove ―W‖ , ―t‖ and added ―ddd‖, ―eee‖ symbols in
WBGA96 package outline drawing diagram
97
Revise storage temperature up to 150°C
138, 147, 155
Revise -11 speed grade DDR3-1866 data setup/hold
time AC parameters tDS/tDH spec
103
Update allowed time before ringback (tDVAC) for CK -
CK# and DQS - DQS# spec (Table 20)
A04 Feb. 27, 2013
103
Update single-ended levels for CK, DQSL, DQSU,
CK#, DQSL# or DQSU# spec (Table 21)
150
Update required time tVAC above VIH(AC) {below
VIL(AC)} for valid ADD/CMD transition spec (Table 53)
156
Update derating values for DDR3-1866 tDS/tDH -
(AC135) (Table 56)
156
Update required time tVAC above VIH(AC) {below
VIL(AC)} for valid DQ transition spec (Table 57)
Important Notice
Winbond products are not designed, intended, authorized or warranted for use as components
in systems or equipment intended for surgical implantation, atomic energy control
instruments, airplane or spaceship instruments, transportation instruments, traffic signal
instruments, combustion control instruments, or for other applications intended to support or
sustain life. Further more, Winbond products are not intended for applications wherein failure
of Winbond products could result or lead to a situation wherein personal injury, death or
severe property or environmental damage could occur.
Winbond customers using or selling these products for use in such applications do so at their
own risk and agree to fully indemnify Winbond for any damages resulting from such improper
use or sales.
- 158 -
Publication Release Date: Feb. 27, 2013
Revision A04