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JDP2S01T Datasheet, PDF (147/150 Pages) Toshiba Semiconductor – UHF~VHF Band RF Attenuator Applications | |||
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Philips Semiconductors
ISP1362
Single-chip USB OTG controller
[3] These transparent plastic packages are extremely sensitive to reï¬ow soldering conditions and must
on no account be processed through more than one soldering cycle or subjected to infrared reï¬ow
soldering with peak temperature exceeding 217 °C ± 10 °C measured in the atmosphere of the reï¬ow
oven. The package body peak temperature must be kept as low as possible.
[4] These packages are not suitable for wave soldering. On versions with the heatsink on the bottom
side, the solder cannot penetrate between the printed-circuit board and the heatsink. On versions with
the heatsink on the top side, the solder might be deposited on the heatsink surface.
[5] If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave
direction. The package footprint must incorporate solder thieves downstream and at the side corners.
[6] Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it
is deï¬nitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
[7] Wave soldering is suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than
0.65 mm; it is deï¬nitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
[8] Image sensor packages in principle should not be soldered. They are mounted in sockets or delivered
pre-mounted on ï¬ex foil. However, the image sensor package can be mounted by the client on a ï¬ex
foil by using a hot bar soldering process. The appropriate soldering proï¬le can be provided on
request.
[9] Hot bar soldering or manual soldering is suitable for PMFP packages.
9397 750 12337
Product data
Rev. 03 â 06 January 2004
© Koninklijke Philips Electronics N.V. 2004. All rights reserved.
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