JDP2S01T Datasheet, PDF (143/150 Pages) Toshiba Semiconductor – UHF~VHF Band RF Attenuator Applications

Philips Semiconductors
ISP1362
Single-chip USB OTG controller
21. Package outline
LQFP64: plastic low profile quad flat package; 64 leads; body 10 x 10 x 1.4 mm
SOT314-2
y
48
49
X
33
32 ^Z _E
c
A
64
1
pin 1 index
e
wM
b_p
D
HD
17
16
ZD
e
wM
b_p
E ^HE
vM A
B
vM B
A ^A2
A₁
detail X
(A ₃)
θ
L_p
L
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
A
UNIT _max. A₁ A₂ A₃ b_p
c D⁽¹⁾ E⁽¹⁾ e
H_D H_E L
mm
1.6
0.20
0.05
1.45
1.35
0.25
0.27
0.17
0.18
0.12
10.1
9.9
10.1
9.9
0.5
12.15 12.15
11.85 11.85
1
L_p v
w
y
Z _D ⁽¹⁾
Z
(1)
E
θ
0.75
0.45
0.2
0.12
0.1
1.45 1.45
1.05 1.05
7^o
0^o
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
OUTLINE
VERSION
SOT314-2
IEC
136E10
REFERENCES
JEDEC
JEITA
MS-026
EUROPEAN
PROJECTION
ISSUE DATE
00-01-19
03-02-25
Fig 39. LQFP64 package outline.
9397 750 12337
Product data
Rev. 03 — 06 January 2004
© Koninklijke Philips Electronics N.V. 2004. All rights reserved.
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