JDP2S01T Datasheet, PDF (144/150 Pages) Toshiba Semiconductor – UHF~VHF Band RF Attenuator Applications

Philips Semiconductors
ISP1362
Single-chip USB OTG controller
TFBGA64: plastic thin fine-pitch ball grid array package; 64 balls; body 6 x 6 x 0.8 mm
ball A1
index area
D
BA
A ^A2
E
A₁
detail X
SOT543-1
e1
e
1/2 e b
K
J
H
G
F
E
D
C
B
A
ball A1
index area
1 2 3 4 5 6 7 8 9 10
∅v M C A B
∅w M C
e
e2
1/2 e
y1 _C
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
max.
A1
A2
b
DE
e
e1 e2
v
w
y
y1
mm
1.1
0.25 0.85 0.35
0.15 0.75 0.25
6.1
5.9
6.1
5.9
0.5
4.5
4.5 0.15 0.05 0.08 0.1
C
y
X
OUTLINE
VERSION
IEC
SOT543-1
---
REFERENCES
JEDEC
JEITA
MO-195
---
Fig 40. TFBGA64 package outline.
9397 750 12337
Product data
Rev. 03 — 06 January 2004
EUROPEAN
PROJECTION
ISSUE DATE
00-11-22
02-04-09
© Koninklijke Philips Electronics N.V. 2004. All rights reserved.
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