C5ENPB0-DS Datasheet, PDF (79/118 Pages) Freescale Semiconductor, Inc – C-5e Network Processor Silicon Revision B0

Power and Thermal
Characteristics
Power and Thermal Characteristics
79
Table 40 provides the derived power and thermal characteristics for the production
version of the C-5e NP.
Table 40 C-5e Network Processor Power and Thermal Characteristics
PARAMETER
MIN TYP MAX UNITS TEST CONDITIONS
Power Dissipation, P_D
5.5
Power Dissipation, P_D
5.5
Maximum Junction
Temperature, T_J
Thermal Resistance, junction
to case, θ_JC
Thermal Resistance, junction
to printed circuit board, θ_JB
10.6 15.0 W
9.2 13.0 W
125 ^oC
300MHz core clock*
266MHz core clock*
All clock speeds
<0.1
o_C/W
4.8
o_C/W
* _{Power dissipation values assume the following conditions: BMU memory operating at 133MHz. TLU memory}
operating at 133MHz. QMU memory operating at 160MHz (refer to Table 57 for details. VDD= 1.25V, VDD33=
3.3V, TJ at approximately 50°C for typical values. VDD and VDD33 are 5% higher for maximum values.
“Minimum” PD based on idle conditions (clocks running and no programs executing). “Typical” PD based on
test application that implements Fast Ethernet forwarding actively running on all CPs. “Maximum” PD based
on maximum consumption for any high-bandwidth communications application executing on all CPs, FP
and XP.
FREESCALE SEMICONDUCTOR
C5ENPB0-DS REV 08