C5ENPB0-DS Datasheet, PDF (111/118 Pages) Freescale Semiconductor, Inc – C-5e Network Processor Silicon Revision B0

Marking Codes
Reflow
Marking Codes 111
Table 63 explains the marking on the C-5e NP.
Table 63 C-5e Network Processor Marking Codes
MARKING (EXPLANATION OF CODES)
Top
Logo/Part#/Date Code
Bottom
N/A
Pin 1 Marking Chamfered Corner
Typical Reflow Profile for the C-5e Switch Module comprises:
1 Follow the guidelines recommended by your solder paste supplier.
Flux requirements must be met for best solderability.
2 The temperature profile should be carefully characterized to ensure uniform
temperature across the board and package.
Solder ball voiding may be affected by ramp rates and dwell times below and above
liquids.
3 A nitrogen atmosphere is not required, but will make the process more robust. It can
make a difference for marginally solderable PC board pads.
4 Full convection forced air furnaces work best, but IR, Convection/IR, or vapor phase can
be used.
FREESCALE SEMICONDUCTOR
C5ENPB0-DS REV 08