CS43130 Datasheet, PDF (135/137 Pages) Cirrus Logic – 130-dB, 32-Bit High-Performance DAC with Integrated Headphone Driver

10.2 42-Ball WLCSP Package Dimensions
A.
A3
X
A2
A1
CS43130
10.2 42-Ball WLCSP Package Dimensions
M.
Ball A1
1
b
Ball A1
Location
Indicator
Y
N
e
d
e.
c
Wafer Back Side
Side View
Bump Side
Notes:
• Controlling dimensions are in millimeters.
• Dimensioning and tolerances per ASME Y 14.5M-1994.
• The Ball A1 position indicator is for illustration purposes only and may not be to scale.
• Dimension “b” applies to the solder sphere diameter and is measured at the midpoint between the package body and the seating plane
datum Z.
• Dimension A3 describes the thickness of the backside film.
Figure 10-2. 42-Ball WLCSP Package Drawing
Table 10-2. 42-Ball WLCSP Package Dimensions
Dimension
Minimum
Millimeters
Nominal
Maximum
A
0.461
0.491
0.521
A1
0.175
0.190
0.205
A2
0.286
0.301
0.316
A3
—
0.022
—
M
—
2.000
—
N
—
2.400
—
b
0.220
0.270
0.320
c
—
0.354
—
d
—
0.391
—
e
—
0.400
—
X
—
2.707
—
Y
—
3.181
—
Notes: X/Y dimensions are estimates.
• Unless otherwise specified, tolerances are: Linear ±0.05 mm, Angular ±1 deg
DS1073F1
135