CS43130 Datasheet, PDF (121/137 Pages) Cirrus Logic – 130-dB, 32-Bit High-Performance DAC with Integrated Headphone Driver

CS43130
8 PCB Layout Considerations
8 PCB Layout Considerations
The following sections provide general guidelines for PCB layout to ensure the best performance of the CS43130.
8.1 Power Supply
As with any high-resolution converter, the CS43130 requires careful attention to power supply and grounding
arrangements if its potential performance is to be realized. Fig. 2-1 shows the recommended power arrangements with
VA and VCP connected to independent clean supplies. VL and VD, which power the digital circuitry, may be run from the
shared system logic supply.
8.2 Grounding
Note the following:
• Extensive use of power and ground planes, ground-plane fill in unused areas, and surface-mount decoupling
capacitors are recommended.
• Decoupling capacitors must be as close as possible to the CS43130 pins.
• To minimize inductance effects, the low-value ceramic capacitor must be closest to the pin and mounted on the
same side of the board as the CS43130.
• To avoid unwanted coupling into the modulators, all signals, especially clocks, must be isolated from the FILT+ and
FILT- pins.
• The FILT+ capacitors must be positioned to minimize the electrical path from the pin to VA.
• The FILT– capacitors must be positioned to minimize the electrical path from the pin to –VA.
• The VCP_FILT+ and VCP_FILT– capacitors must be positioned to minimize the electrical path from each respective
pin to GNDCP.
8.3 HPREFA and HPREFB Routing
For best interchannel isolation performance, HPREFA and HPREFB must be routed independently to the headphone
connector reference pin. The HPREFA and HPREFB are electrically connected to system’s ground plane through via at
the headphone connector ground pin. Fig. 2-1 illustrates the recommended arrangements.
For interfacing the HPREFA and HPREFB pins with an IC that performs alternate pinout headset detect functions, both
signals must be routed independently to the CS43130’s ground pin connecting the detected headset ground pole. Follow
the recommended grounding scheme of the CS43130.
8.4 QFN Thermal Pad
The CS43130 comes in a compact QFN package, the underside of which reveals a large metal pad that serves as a
thermal relief to provide maximum heat dissipation. This pad must mate with an matching copper pad on the PCB and
must be electrically connected to ground. A series of vias must be used to connect this copper pad to one or more larger
ground planes on other PCB layers. For best performance in split-ground systems, connect this thermal pad to GNDA.
DS1073F1
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