CS43130 Datasheet, PDF (134/137 Pages) Cirrus Logic – 130-dB, 32-Bit High-Performance DAC with Integrated Headphone Driver

10 Package Dimensions
10.1 40-Pin QFN Package Dimensions
CS43130
10 Package Dimensions
Figure 10-1. 40-Pin QFN Package Drawing
Table 10-1. 40-Pin QFN Package Dimensions
Description
Dim
Minimum
Millimeters
Nominal
Maximum
Total thickness
A
0.7
0.75
0.8
Stand off
A1
0
0.035
0.05
Mold thickness
A2
—
0.55
—
L/F thickness
A3
0.203 REF
Lead width
b
0.15
0.2
0.25
Body size
X
D
5 BSC
Y
E
5 BSC
Lead pitch
e
0.4 BSC
EP size
X
J
3.4
3.5
3.6
Y
K
3.4
3.5
3.6
Lead length
L
0.35
0.4
0.45
Package edge tolerance
aaa
0.1
Mold flatness
bbb
0.1
Coplanarity
ccc
0.08
Lead offset
ddd
0.1
Exposed pad offset
eee
0.1
Notes:
• Dimensioning and tolerances per ASME Y 14.5M–1995.
• X/Y Dimensions are estimates.
• The Ball 1 location indicator shown above is for illustration purposes only and may not be to scale.
• Dimensioning and tolerances per ASME Y 14.5M–1994.
• Dimension “b” applies to the solder sphere diameter and is measured at the midpoint between the
package body and the seating plane.
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DS1073F1