PIC24FJ128GC010 Datasheet, PDF (426/472 Pages) Microchip Technology – 16-Bit Flash Microcontrollers with 12-Bit Pipeline A/D, Sigma-Delta A/D, USB On-The-Go and XLP Technology

PIC24FJ128GC010 FAMILY
37.1 DC Characteristics
FIGURE 37-1:
PIC24FJ128GC010 FAMILY VOLTAGE-FREQUENCY GRAPH (INDUSTRIAL)
3.6V
(Note 1)
PIC24FJXXXGC0XX
3.6V
(Note 1)
Frequency
32 MHz
Note 1: Lower recommended operating boundary is 2.0V or VBOR (when BOR is enabled). For best
analog performance, operation above 2.2V is suggested, but not required.
TABLE 37-1: THERMAL OPERATING CONDITIONS
Rating
PIC24FJ128GC010 Family:
Operating Junction Temperature Range
Operating Ambient Temperature Range
Power Dissipation:
Internal Chip Power Dissipation: PINT = VDD x (IDD –  IOH)
I/O Pin Power Dissipation:
PI/O =  ({VDD – VOH} x IOH) +  (VOL x IOL)
Maximum Allowed Power Dissipation
Symbol Min
Typ
Max Unit
TJ
-40
—
+100
°C
TA
-40
—
+85
°C
PD
PINT + PI/O
W
PDMAX
(TJMAX – TA)/JA
W
TABLE 37-2: THERMAL PACKAGING CHARACTERISTICS
Characteristic
Symbol Typ Max Unit Note
Package Thermal Resistance, 12x12x1 mm 100-pin TQFP
JA
45.0
—
°C/W (Note 1)
Package Thermal Resistance, 10x10x1 mm 64-pin TQFP
JA
48.3
—
°C/W (Note 1)
Package Thermal Resistance, 9x9x0.9 mm 64-pin QFN
JA
28.0
—
°C/W (Note 1)
Package Thermal Resistance, 10x10x1.1 mm 121-pin BGA
JA
40.2
—
°C/W (Note 1)
Note 1: Junction to ambient thermal resistance, Theta-JA (JA) numbers are achieved by package simulations.
DS30009312B-page 426
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