80546KF Datasheet, PDF (65/138 Pages) Intel Corporation – 64-bit Intel Xeon Processor MP with up to 8MB L3 Cache

Mechanical Specifications
4.2
Processor Component Keep-Out Zones
The processor may contain components on the substrate that define component keep-out zone
requirements. A thermal and mechanical solution design must not intrude into the required keep-
out zones. Decoupling capacitors are typically mounted to either the topside or pin-side of the
package substrate. See Figure 4-2 and Figure 4-3 for keepout zones.
4.3
Package Loading Specifications
Table 4-1 provides dynamic and static load specifications for the processor package. These
mechanical load limits should not be exceeded during heatsink assembly, shipping conditions, or
standard use condition. Also, any mechanical system or component testing should not exceed the
maximum limits. The processor package substrate should not be used as a mechanical reference or
load-bearing surface for thermal and mechanical solutions. The minimum loading specification
must be maintained by any thermal and mechanical solution.
Table 4-1. Processor Loading Specifications
Parameter
Minimum
Maximum
Unit
44
222
N
Static Compressive
10
50
lbf
Load
44
288
N
10
65
lbf
Dynamic
Compressive Load
222 N + 0.45 kg * 100 G
N
50 lbf (static) + 1 lbm * 100 G
lbf
288 N + 0.45 kg * 100 G
N
65 lbf (static) + 1 lbm * 100 G
lbf
Transient
445
N
100
lbf
Notes
1, 2, 3, 4
1, 2, 3, 5
1, 3, 4, 6, 7
1, 3, 5, 6, 7
1, 3, 8
NOTES:
1. These specifications apply to uniform compressive loading in a direction perpendicular to the IHS top
surface.
2. This is the minimum and maximum static force that can be applied by the heatsink and retention solution to
maintain the heatsink and processor interface.
3. These parameters are based on limited testing for design characterization. Loading limits are for the package
only and do not include the limits of the processor socket.
4. This specification applies for thermal retention solutions that allow baseboard deflection.
5. This specification applies either for thermal retention solutions that prevent baseboard deflection or for the
Intel enabled reference solution.
6. Dynamic loading is defined as an 11 ms duration average load superimposed on the static load requirement.
7. Experimentally validated test condition used a heatsink mass of 1 lbm (~0.45 kg) with 100 G acceleration
measured at heatsink mass. The dynamic portion of this specification in the product application can have
flexibility in specific values, but the ultimate product of mass times acceleration should not exceed this
validated dynamic load (1 lbm x 100 G = 100 lb).
8. Transient loading is defined as a 2 second duration peak load superimposed on the static load requirement,
representative of loads experienced by the package during heatsink installation.
64-bit Intel^® Xeon™ Processor MP with up to 8MB L3 Cache Datasheet
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