80546KF Datasheet, PDF (61/138 Pages) Intel Corporation – 64-bit Intel Xeon Processor MP with up to 8MB L3 Cache

4 Mechanical Specifications
The 64-bit Intel^® Xeon™ processor MP with up to 8MB L3 cache is packaged in a Flip-Chip
Micro Pin Grid Array 4 (FC-mPGA4) package that interfaces with the motherboard via a
mPGA604 socket. The package consists of a processor core mounted on a substrate pin-carrier. An
integrated heat spreader (IHS) is attached to the package substrate and core and serves as the
mating surface for processor component thermal solutions, such as a heatsink. Figure 4-1 shows a
sketch of the processor package components and how they are assembled together.
The package components shown in Figure 4-1 include the following:
1. Integrated Heat Spreader (IHS)
2. Processor die
3. FC-mPGA4 package
4. Pin-side capacitors
5. Package pin
Figure 4-1. Processor Package Assembly Sketch
1¹
22
33
4⁴
5⁵
Note: This drawing is not to scale and is for reference only. The mPGA604 socket is not shown.
64-bit Intel^® Xeon™ Processor MP with up to 8MB L3 Cache Datasheet
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