English
Language : 

HD64F3670 Datasheet, PDF (256/323 Pages) Renesas Technology Corp – Hitachi Single-Chip Microcomputer
Item
Test
Values
Symbol Condition
Min
Typ Max Unit
Erase
Wait time after SWE
x
bit setting*1
1
—
—
µs
Wait time after ESU
y
bit setting*1
100 —
—
µs
Wait time after E bit
z
setting*1*6
10
—
100 ms
Wait time after E bit clear*1 α
Wait time after ESU bit clear*1 β
10
—
—
µs
10
—
—
µs
Wait time after EV
γ
bit setting*1
Wait time after dummy write*1 ε
Wait time after EV bit clear*1 η
20
—
—
µs
2
—
—
µs
4
—
—
µs
Wait time after SWE
θ
bit clear*1
Maximum erase count*1*6*7 N
100 —
—
—
—
µs
120 Times
Notes: 1. Make the time settings in accordance with the program/erase algorithms.
2. The programming time for 128 bytes. (Indicates the total time for which the P bit in flash
memory control register 1 (FLMCR1) is set. The program-verify time is not included.)
3. The time required to erase one block. (Indicates the time for which the E bit in flash
memory control register 1 (FLMCR1) is set. The erase-verify time is not included.)
4. Programming time maximum value (tP(MAX)) = wait time after P bit setting (z) ×
maximum programming count (N)
5. Set the maximum programming count (N) according to the actual set values of z1, z2,
and z3, so that it does not exceed the programming time maximum value (tP(MAX)).
The wait time after P bit setting (z1, z2) should be changed as follows according to the
value of the programming count (n).
Programming count (n)
1≤n≤6
z1 = 30 µs
7 ≤ n ≤ 1000 z2 = 200 µs
6. Erase time maximum value (tE(max)) = wait time after E bit setting (z) × maximum erase
count (N)
7. Set the maximum maximum erase count (N) according to the actual set value of (z), so
that it does not exceed the erase time maximum value (tE(max)).
Rev. 2.0, 03/02, page 232 of 298