MC9S12Q128_10 Datasheet, PDF (635/644 Pages) Freescale Semiconductor, Inc – HCS12 Microcontrollers

C.1.2
52-Pin LQFP Package
4X
0.20 (0.008) H L-M N
4X 13 TIPS
0.20 (0.008) T L-M N
52
1
-L-
40
39
3X VIEW Y
-M-
BV
13
14
A1
S1
-N-
A
S
27
26
B1 _V1
C
-H-
-T-
SEATING
PLANE
4X θ2
4X θ3
0.10 (0.004) T
VIEW AA
Appendix C Package Information
CL
AB
AB
VIEW Y
PLATING
F
-X-
X=L, M, N
G
BASE METAL
J
U
D
0.13 (0.005) M T L-M S N S
SECTION AB-AB
ROTATED 90 ° CLOCKWISE
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
CONTROLLING DIMENSION: MILLIMETER
DATUM PLANE -H- IS LOCATED AT BOTTOM OF LEAD AND IS COINCIDENT
WITH THE LEAD WHERE THE LEAD EXITS THE PLASTIC BODY AT THE
BOTTOM OF THE PARTING LINE.
2. DATUMS -L-, -M- AND -N- TO BE DETERMINED AT DATUM PLANE -H-.
DIMENSIONS S AND V TO BE DETERMINED AT SEATING PLANE -T-.
DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION.
ALLOWABLE PROTRUSION IS 0.25 (0.010) PER SIDE. DIMENSIONS A AND
B DO INCLUDE MOLD MISMATCH AND ARE DETERMINED AT DATUM
PLANE -H-
DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. DAMBAR
PROTRUSION SHALL NOT CAUSE THE LEAD WIDTH TO EXCEED 0.46
(0.018). MINIMUM SPACE BETWEEN PROTRUSION AND ADJACENT LEAD
OR PROTRUSION 0.07 (0.003).
0.05 (0.002) S
C2
C1
VIEW AA
W
θ1
θ
K
E
Z
2X R R1
0.25 (0.010)
GAGE PLANE
MILLIMETERS
INCHES
DIM MIN MAX MIN MAX
A 10.00 BSC
0.394 BSC
A1 5.00 BSC
0.197 BSC
B 10.00 BSC
0.394 BSC
B1 5.00 BSC
0.197 BSC
C
--- 1.70
--- 0.067
C1 0.05 0.20 0.002 0.008
C2 1.30 1.50 0.051 0.059
D 0.20 0.40 0.008 0.016
E 0.45 0.75 0.018 0.030
F 0.22 0.35 0.009 0.014
G
0.65 BSC
0.026 BSC
J 0.07 0.20 0.003 0.008
K
0.50 REF
0.020 REF
R1 0.08 0.20 0.003 0.008
S
12.00 BSC
0.472 BSC
S1 6.00 BSC
0.236 BSC
U 0.09 0.16 0.004 0.006
V
12.00 BSC
0.472 BSC
V1
6.00 BSC
0.236 BSC
W
0.20 REF
0.008 REF
Z
1.00 REF
0.039 REF
θ 0° 7°
θ1 0_° ---
θ2
12_° REF
θ3
12_° REF
0° 7°
0° ---
12_° REF
12_° REF
Figure C-2. 52-Pin LQFP Mechanical Dimensions (Case no. 848D-03)
Freescale Semiconductor
MC9S12Q128
635
Rev 1.10