DS925 Datasheet, PDF (3/109 Pages) Xilinx, Inc – DC and AC Switching Characteristics

Zynq UltraScale+ MPSoC Data Sheet: DC and AC Switching Characteristics
Table 1: Absolute Maximum Ratings⁽¹⁾ (Cont’d)
Symbol
Description
Min
Max
Units
PL System Monitor
V_CCADC
V_REFP
Temperature
PL System Monitor supply relative to GNDADC.
PL System Monitor reference input relative to GNDADC.
0.500
0.500
2.000
V
2.000
V
T_STG
T_SOL
T_j
Storage temperature (ambient).
Maximum soldering temperature⁽⁹⁾.
Maximum junction temperature⁽⁹⁾.
–65
150
°C
–
260
°C
–
125
°C
Notes:
1. Stresses beyond those listed under Absolute Maximum Ratings might cause permanent damage to the device. These are
stress ratings only, and functional operation of the device at these or any other conditions beyond those listed under
Operating Conditions is not implied. Exposure to Absolute Maximum Ratings conditions for extended periods of time might
affect device reliability.
2. V_{CCINT_IO} must be connected to V_CCBRAM.
3. V_{CCAUX_IO} must be connected to V_CCAUX.
4. The lower absolute voltage specification always applies.
5. If V_CCO is 3.3V, the maximum voltage is 3.4V.
6. For I/O operation, see the UltraScale Architecture SelectIO Resources User Guide (UG571).
7. The maximum limit applied to DC signals. For maximum undershoot and overshoot AC specifications, see Table 6 and
Table 7.
8. For more information on supported GTH or GTY transceiver terminations see the UltraScale Architecture GTH Transceiver
User Guide (UG576) or UltraScale Architecture GTY Transceiver User Guide (UG578)
9. For soldering guidelines and thermal considerations, see the Zynq UltraScale+ MPSoC Packaging and Pinout Specifications
(UG1075).
DS925 (v1.1) June 20, 2016
Advance Product Specification
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