HD6473837H Datasheet, PDF (561/562 Pages) Renesas Technology Corp – Hardware Manual

16.0 ± 0.2
14
75
51
76
50
Unit: mm
100
1
0.22 ± 0.05
0.20 ± 0.04
26
25
0.08 M
1.0
0.10
1.0
0.5 ± 0.1
0° – 8°
Dimension including the plating thickness
Base material dimension
Figure F.3 TFP-100B Package Dimensions
Note: In case of inconsistencies arising within figures, dimensional drawings listed in the
Hitachi Semiconductor Packages Manual take precedence and are considered correct.
544