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MC9S12NE64_06 Datasheet, PDF (504/554 Pages) Freescale Semiconductor, Inc – Microcontrollers | |||
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Appendix A Electrical Characteristics
Table A-1. Absolute Maximum Ratings
Num
Rating
Symbol
Min
Max Unit
1 I/O, Regulator and Analog Supply Voltage
VDD3
â0.3
4.5
V
2 Digital Logic Supply Voltage 1
VDD
â0.3
3.0
V
3 PLL Supply Voltage 1
VDDPLL
â0.3
3.0
V
4 Voltage difference VDDX to VDDR and VDDA
5 Voltage difference VSSX to VSSR and VSSA
âVDDX
âVSSX
â0.3
â0.3
0.3
V
0.3
V
6 Digital I/O Input Voltage
VIN
â0.3
6.5
V
7 Analog Reference
VRH, VRL
â0.3
6.5
V
8 XFC, EXTAL, XTAL inputs
VILV
â0.3
3.0
V
9 TEST input
VTEST
â0.3
10.0
V
Instantaneous Maximum Current
10 Single pin limit for all digital I/O pins 2
ID
â25
+25
mA
Instantaneous Maximum Current
11 Single pin limit for XFC, EXTAL, XTAL 3
IDL
â25
+25
mA
Instantaneous Maximum Current
12 Single pin limit for TEST 4
IDT
â0.25
0
mA
13 Operating Temperature Range (ambient)
TA
â40
105 5
°C
14 Operating Temperature Range (junction)
TJ
â40
140
°C
15 Storage Temperature Range
Tstg
â65
155
°C
1 The device contains an internal voltage regulator to generate the logic and PLL supply out of the I/O supply. The
absolute maximum ratings apply when the device is powered from an external source.
2 All digital I/O pins are internally clamped to VSSX and VDDX, VDDR or VSSA and VDDA.
3 These pins are internally clamped to VSSPLL and VDDPLL.
4 This pin is clamped low to VSSPLL, but not clamped high. This pin must be tied low in applications.
5 Maximum ambient temperature is package dependent.
A.6 ESD Protection and Latch-Up Immunity
All ESD testing is in conformity with CDF-AEC-Q100 stress test qualiï¬cation for automotive
grade integrated circuits. During the device qualiï¬cation ESD stresses were performed for the
human body model (HBM), the machine model (MM), and the charge device model.
A device will be deï¬ned as a failure if after exposure to ESD pulses the device no longer meets the
device speciï¬cation. Complete DC parametric and functional testing is performed per the
applicable device speciï¬cation at room temperature followed by hot temperature, unless speciï¬ed
otherwise in the device speciï¬cation.
MC9S12NE64 Data Sheet, Rev. 1.1
504
Freescale Semiconductor
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