DS003-1 Datasheet, PDF (3/76 Pages) Xilinx, Inc – Fast, high-density Field-Programmable Gate Arrays

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Virtex™ 2.5 V Field Programmable Gate Arrays
Virtex Device/Package Combinations and Maximum I/O
Table 3: Virtex Family Maximum User I/O by Device/Package (Excluding Dedicated Clock Pins)
Package XCV50 XCV100 XCV150 XCV200 XCV300 XCV400 XCV600 XCV800
CS144
94
94
TQ144
98
98
PQ240
166
166
166
166
166
HQ240
166
166
166
BG256
180
180
180
180
BG352
260
260
260
BG432
316
316
316
316
BG560
404
404
404
FG256
176
176
176
176
FG456
260
284
312
FG676
404
444
444
FG680
512
512
XCV1000
404
512
Virtex Ordering Information
Example: XCV300 -6 PQ 240 C
Device Type
Speed Grade
Temperature Range
C = Commercial (T_J = 0°C to +85°C)
I = Industrial (T_J = –40°C to +100°C)
-4
-5
Number of Pins
-6
Package Type
BG = Ball Grid Array
FG = Fine-pitch Ball Grid Array
PQ = Plastic Quad Flat Pack
HQ = High Heat Dissipation QFP
TQ = Thin Quad Flat Pack
CS = Chip-scale Package
Figure 1: Virtex Ordering Information
DS003-1 (v2.5 ) April 2, 2001
Product Specification
www.xilinx.com
1-800-255-7778
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