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DS003-1 Datasheet, PDF (27/76 Pages) Xilinx, Inc – Fast, high-density Field-Programmable Gate Arrays
R
Virtex™ 2.5 V Field Programmable Gate Arrays
DC Characteristics Over Recommended Operating Conditions
Symbol
Description
Device
Min Max Units
VDRINT
Data Retention VCCINT Voltage
(below which configuration data can be lost)
All
2.0
V
VDRIO
Data Retention VCCO Voltage
(below which configuration data can be lost)
All
1.2
V
ICCINTQ Quiescent VCCINT supply current(1,3)
XCV50
XCV100
50
mA
50
mA
XCV150
50
mA
XCV200
75
mA
XCV300
75
mA
XCV400
75
mA
XCV600
100 mA
XCV800
100 mA
XCV1000
100 mA
ICCOQ Quiescent VCCO supply current(1)
XCV50
XCV100
2
mA
2
mA
XCV150
2
mA
XCV200
2
mA
XCV300
2
mA
XCV400
2
mA
XCV600
2
mA
XCV800
2
mA
XCV1000
2
mA
IREF
IL
CIN
IRPU
VREF current per VREF pin
Input or output leakage current
Input capacitance (sample tested)
BGA, PQ, HQ, packages
Pad pull-up (when selected) @ Vin = 0 V, VCCO = 3.3 V (sample
tested)
All
20
µA
All
–10 +10 µA
All
8
pF
All
Note (2) 0.25 mA
IRPD Pad pull-down (when selected) @ Vin = 3.6 V (sample tested)
Note (2) 0.15 mA
Notes:
1. With no output current loads, no active input pull-up resistors, all I/O pins 3-stated and floating.
2. Internal pull-up and pull-down resistors guarantee valid logic levels at unconnected input pins. These pull-up and pull-down resistors
do not guarantee valid logic levels when input pins are connected to other circuits.
3. Multiply ICCINTQ limit by two for industrial grade.
DS003-3 (v3.2) September 10, 2002
Production Product Specification
www.xilinx.com
1-800-255-7778
Module 3 of 4
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