S71PL129JC0 Datasheet, PDF (77/149 Pages) SPANSION – Stacked Multi-Chip Product (MCP) Flash Memory

Advance Information
Addresses
WE#
OE#
CE#
Data
RESET#
555 for program
2AA for erase
PA for program
SA for sector erase
555 for chip erase
t_WC
t_AS
t_AH
t_WH
Data# Polling
PA
t_GHEL
t_CP
t_WS
t_CPH
t_DS
t_DH
t_{WHWH1 or 2}
t_BUSY
t_RH
A0 for program PD for program
55 for erase
30 for sector erase
10 for chip erase
DQ7# D_OUT
RY/BY#
Notes:
1. Figure indicates last two bus cycles of a program or erase operation.
2. PA = program address, SA = sector address, PD = program data.
3. DQ7# is the complement of the data written to the device. D_OUT is the data written to the device
4. S29PL129J - During CE1# transitions, CE2# = V_IH; During CE2# transitions, CE1# = V_IH
5. S29PL129J - There are two CE# (CE1#, CE2#). In the above waveform CE# = CE1# or CE2#
Table 23. Alternate CE# Controlled Write (Erase/Program) Operation Timings
Table 24. CE1#/CE2# Timing
Parameter
JEDEC Std
Description
t_CCR CE1#/CE2# Recover Time
Min
All Speed Options
30
Unit
ns
June 4, 2004 S29PL129J_MCP_00_A0
S29PL129J for MCP
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