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S71PL129JC0 Datasheet, PDF (137/149 Pages) SPANSION – Stacked Multi-Chip Product (MCP) Flash Memory
Advance information
AC Characteristics
Power Down Parameters
Parameter
CE2 Low Setup Time for Power Down Entry
CE2 Low Hold Time after Power Down Entry
CE1# High Hold Time following CE2 High after Power
Down Exit [SLEEP mode only]
CE1# High Hold Time following CE2 High after Power
Down Exit [not in SLEEP mode]
CE1# High Setup Time following CE2 High after Power
Down Exit
16M
32M
64M
Symbol Min. Max. Min. Max. Min. Max. Unit Note
tCSP 10 — 10 — 10 — ns
tC2LP 80 — 65 — 65 — ns
tCHH 300 — 300 — 300 —
µs
1
tCHHP
N/A
1 — 1 — µs 2
tCHS
0
—
0
—
0
— ns
1
Notes:
1. Applicable also to power-up.
2. Applicable when 4Mb and 8Mb Partial modes are programmed.
Other Timing Parameters
16M
32M
64M
Parameter
Symbol Min. Max. Min. Max. Min. Max. Unit Note
CE1# High to OE# Invalid Time for Standby Entry
tCHOX 10 — 10 — 10 — ns
CE1# High to WE# Invalid Time for Standby Entry
tCHWX 10 — 10 — 10 —
ns
1
CE2 Low Hold Time after Power-up
tC2LH 50 — 50 — 50 — µs
CE1# High Hold Time following CE2 High after Power-up tCHH 300 — 300 — 300 — µs
Input Transition Time
tT
1 25 1 25 1 25 ns 2
Notes:
1. Some data might be written into any address location if tCHWX(min) is not satisfied.
2. The Input Transition Time (tT) at AC testing is 5ns as shown in below. If actual tT is longer than 5ns, it can violate the AC
specification of some of the timing parameters.
November 2, 2004 pSRAM_Type07_13_A1
pSRAM Type 7
137