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S71PL129JC0 Datasheet, PDF (69/149 Pages) SPANSION – Stacked Multi-Chip Product (MCP) Flash Memory
Advance Information
Erase/Program Operations
Table 20. Erase and Program Operations
Parameter
JEDEC
Std Description
tAVAV
tAVWL
tWC Write Cycle Time (Note 1)
tAS Address Setup Time
tASO
Address Setup Time to OE# low during toggle bit
polling
tWLAX
tAH Address Hold Time
tAHT
Address Hold Time From CE1#, CE#2 or OE# high
during toggle bit polling
tDVWH
tWHDX
tGHWL
tDS
tDH
tOEPH
tGHWL
Data Setup Time
Data Hold Time
Output Enable High during toggle bit polling
Read Recovery Time Before Write
(OE# High to WE# Low)
tELWL
tWHEH
tWLWH
tWHDL
tWHWH1
tWHWH1
tWHWH2
tCS CE1# or CE#2 Setup Time
tCH CE1# or CE#2 Hold Time
tWP Write Pulse Width
tWPH Write Pulse Width High
tSR/W Latency Between Read and Write Operations
tWHWH1 Programming Operation (Note 4)
tWHWH1 Accelerated Programming Operation (Note 4)
tWHWH2 Sector Erase Operation (Note 4)
tVCS VCC Setup Time (Note 1)
tRB Write Recovery Time from RY/BY#
tBUSY Program/Erase Valid to RY/BY# Delay
Speed Options
55
60
65
70 Unit
Min 55 60 65 70 ns
Min
0
ns
Min
15
ns
Min 30
35
ns
Min
0
ns
Min 25
30
ns
Min
0
ns
Min
10
ns
Min
0
ns
Min
0
ns
Min
0
ns
Min
35
ns
Min 20
25
ns
Min
0
ns
Typ
6
µs
Typ
4
µs
Typ
0.5
sec
Min
50
µs
Min
0
ns
Max
90
ns
Min
35
ns
Notes:
1. Not 100% tested.
2. S29PL129J - During CE1# transitions, CE2# = VIH; During CE2# transitions, CE1# = VIH
3. S29PL129J - There are two CE# (CE1#, CE2#).
4. See Table 25, “Erase And Programming Performance,” on page 78 for more information.
June 4, 2004 S29PL129J_MCP_00_A0
S29PL129J for MCP
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