S71PL129JC0 Datasheet, PDF (116/149 Pages) SPANSION – Stacked Multi-Chip Product (MCP) Flash Memory

Advance Information
Deep ICC Characteristics (for 64Mb)
Item
PASR Mode Standby Current
Symbol
I_PASR
Test
Array Partition Typ Max Unit
None
10
V_IN = V_CC or 0V, Chip Disabled, t_A = 85°C
1/4 Array
1/2 Array
60
µA
80
Full Array
120
Item
Symbol
Max Temperature Typ Max
Unit
15°C
50
Temperature Compensated Refresh Current
I_TCR
45°C
70°C
60
µA
80
85°C
120
Item
Deep Sleep Current
Symbol
I_ZZ
Test
V_IN = V_CC or 0V, Chip in ZZ# mode, t_A = 25°C
Address Patterns for PAR (A3= 0, A4=1) (32M)
Typ Max Unit
10
µA
A2 A1 A0
Active Section
0 1 1 One-quarter of die
0 1 0 One-half of die
x 0 0 Full die
1 1 1 One-quarter of die
1 1 0 One-half of die
Address Space
000000h - 07FFFFh
000000h - 0FFFFFh
000000h - 1FFFFFh
180000h - 1FFFFFh
100000h - 1FFFFFh
Address Patterns for RMS (A3 = 1, A4 = 1) (32M)
Size
512Kb x 16
1Mb x 16
2Mb x 16
512Kb x 16
1Mb x 16
Density
8Mb
16Mb
32Mb
8Mb
16Mb
A2 A1 A0
Active Section
0 1 1 One-quarter of die
0 1 0 One-half of die
1 1 1 One-quarter of die
1 1 0 One-half of die
Address Space
000000h - 07FFFFh
000000h - 0FFFFFh
180000h - 1FFFFFh
100000h - 1FFFFFh
Size
512Kb x 16
1Mb x 16
512Kb x 16
1Mb x 16
Density
8Mb
16Mb
8Mb
16Mb
116
pSRAM Type 1
pSRAM_Type01_12_A1 August 30, 2004