W83877ATF Datasheet, PDF (7/191 Pages) Winbond – enhanced version from Winbonds most popular I/O chip W83877F

W83877ATF
• Internal diagnostic capabilities:
− Loop-back controls for communications link fault isolation
− Break, parity, overrun, framing error simulation
• Programmable baud generator allows division of 1.8461 M Hz and 24 MHz by 1 to (2¹⁶-1)
• Maximum baud rate up to 921k bps for 14.768M Hz and 1.5M bps for 24M Hz
Infrared:
• Support IrDA version 1.0 SIR protocol with maximum baud rate up to 115.2K bps
• Support SHARP ASK-IR protocol with maximum baud rate up to 57,600 bps
• Support IrDA version 1.1 MIR (1.152M bps) and FIR (4M bps) protocol
− Single DMA channel for transmitter or receiver
− 32-byte FIFO is supported in both FIR TX/RX transmission
− 8-byte status FIFO is supported to store received frame status (such as overrun, CRC error, etc.)
• Support auto-config SIR and FIR
• Support full Customer IR
• Support driver for Microsoft^TM Windows 95^TM and Windows 98^TM (Memphis ^TM)
Parallel Port:
• Compatible with IBM ^TM parallel port
• Support PS/2 compatible bi-directional parallel port
• Support Enhanced Parallel Port (EPP) − Compatible with IEEE 1284 specification
• Support Extended Capabilities Port (ECP) − Compatible with IEEE 1284 specification
• Extension FDD mode supports disk drive B and Extension 2FDD mode supports disk drives A and B
through parallel port
• Enhanced printer port back-drive current protection
Others:
• Programmable configuration settings
• Immediate or automatic power-down mode for power management
• All hardware power-on settings have internal pull-up or pull-down resistors as default value
• Full 16-bit address decode (UART B pin option)
• PNF pin (Printer-Not-Floppy pin) for distinguishing printer port connection --- FDD or Printer; unique
for notebook application of external floppy through printer port
Package:
• 100-pin QFP (W83877ATF), and also 100-pin TQFP (W83877ATD)
Publication Release Date: April 1998
-3-
Version 0.51