W83877ATF Datasheet, PDF (191/191 Pages) Winbond – enhanced version from Winbonds most popular I/O chip W83877F

W83877ATF
W83877ATD (100-pin TQFP)
100
1
HD
D
81
80
E HE
30
31
51
e
b
50
See Detail F
Seating Plane
A2 A
A1
y
c
θ
L
L1
Detail F
Dimension in inches Dimension in mm
Symbol
Min. Nom. Max. Min. Nom. Max.
A
A1
0.002 0.004 0.006 0.05 0.10 0.15
A 2 0.053 ^0.055 0.057 ^{1.35 1.40 1.45}
b
0.009 0.013 0.015 0.22 0.32 0.38
c
0.004 0.006 0.008 0.10 0.15 0.20
D
0.547 0.551 0.555 13.90 14.00 14.10
E
0.783 0.787 0.791 19.90 20.00 20.10
e
0.020 0.026 0.032 0.498 0.65 0.802
H_D
0.626 0.630 0.634 15.90 16.00 16.10
HE
0.862 0.866 0.870 21.90 22.00 22.10
L
0.018 0.024 0.030 0.45 0.60 0.75
L1
0.039
1.00
y
0.003
0.08
θ
0
7
0
7
Notes:
1. Dimension D & E do not include interlead
flash.
2. Dimension b does not include dambar
protrusion/intrusion.
3. Controlling dimension: Millimeters
4. General appearance spec. should be based
on final visual inspection spec.
Headquarters
No. 4, Creation Rd. III
Science-Based Industrial Park
Hsinchu, Taiwan
TEL: [phone]
FAX: [phone]
www: http://www.winbond.com.tw/
Taipei Office
11F, No. 115, Sec. 3, Min-Sheng East Rd.
Taipei, Taiwan
TEL: [phone]
FAX: [phone]
TLX: 16485 WINTPE
Winbond Electronics (H.K.) Ltd.
Rm. 803, World Trade Square, Tower II
123 Hoi Bun Rd., Kwun Tong
Kowloon, Hong Kong
TEL: [phone]
FAX: [phone]
Winbond Electronics
(North America) Corp.
2730 Orchard Parkway
San Jose, CA 95134 U.S.A.
TEL: [phone]
FAX: [phone]
Please note that all data and specifications are subject to change without notice. All the trade marks of products and companies
mentioned in this data sheet belong to their original owners.
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Publication Release Date: April 1998
Version 0.51