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C8051F850-C-GM Datasheet, PDF (12/328 Pages) Silicon Laboratories – Low-Cost 8-bit MCU Family with up to 8 kB of Flash
Table 1.3. Reset and Supply Monitor
Parameter
VDD Supply Monitor Threshold
Power-On Reset (POR) Threshold
VDD Ramp Time
Reset Delay from POR
Reset Delay from non-POR source
RST Low Time to Generate Reset
Missing Clock Detector Response
Time (final rising edge to reset)
Missing Clock Detector Trigger
Frequency
VDD Supply Monitor Turn-On Time
Symbol
Test Condition
VVDDM
VPOR
tRMP
tPOR
tRST
Rising Voltage on VDD
Falling Voltage on VDD
Time to VDD > 2.2 V
Relative to VDD >
VPOR
Time between release
of reset source and
code execution
tRSTL
tMCD
FSYSCLK > 1 MHz
Min
1.85
—
0.75
10
3
—
15
—
FMCD
—
tMON
—
Typ
1.95
1.4
—
—
10
39
—
0.625
7.5
2
Max
2.1
—
1.36
—
31
—
—
1.2
13.5
—
Unit
V
V
V
µs
ms
µs
µs
ms
kHz
µs
Table 1.4. Flash Memory
Parameter
Symbol
Test Condition
Min Typ Max Units
Write Time1,2
tWRITE
One Byte,
19
20
21
µs
FSYSCLK = 24.5 MHz
Erase Time1,2
tERASE
One Page,
5.2
5.35
5.5
ms
FSYSCLK = 24.5 MHz
VDD Voltage During Programming3
VPROG
2.2
—
3.6
V
Endurance (Write/Erase Cycles)
NWE
20k 100k
— Cycles
Notes:
1. Does not include sequencing time before and after the write/erase operation, which may be multiple SYSCLK cycles.
2. The internal High-Frequency Oscillator has a programmable output frequency using the OSCICL register, which is
factory programmed to 24.5 MHz. If user firmware adjusts the oscillator speed, it must be between 22 and 25 MHz
during any flash write or erase operation. It is recommended to write the OSCICL register back to its reset value when
writing or erasing flash.
3. Flash can be safely programmed at any voltage above the supply monitor threshold (VVDDM).
4. Data Retention Information is published in the Quarterly Quality and Reliability Report.
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Rev. 1.0