GXLV Datasheet, PDF (211/247 Pages) National Semiconductor (TI) – Geode™ GXLV Processor Series Low Power Integrated x86 Solutions

Package Specifications (Continued)
1.65
REF.
D
D1
S1
D
Pin C3
2.29
1.52
REF.
45 ^oCHAMFER
(INDEX CORNER)
Millimeters
Inches
Sym Min Max Min Max
A
2.51 3.07 0.099 0.121
F
B
0.43 0.51 0.017 0.020
D 49.28 49.91 1.940 1.965
D1 45.47 45.97 1.790 1.810
E1 2.41 2.67 0.095 0.105
E2 1.14 1.40 0.045 0.055
F
--
0.127
--
0.005
Diag
Diag
L
2.97 3.38 0.117 0.133
S1 1.65 2.16 0.065 0.085
SEATING
PLANE
L
E2
E1
B
A
D
A01 index mark
.030" blank circle
inside .060" filled
circle to form donut
Figure 7-3. 320-Pin SPGA Mechanical Package Outline
Revision 1.1
211
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