MC68HC908LJ24 Datasheet, PDF (454/464 Pages) Motorola, Inc – Microcontrollers

Freescale Semiconductor, Inc.
Mechanical Specifications
25.5 80-Pin Low-Profile Quad Flat Pack (LQFP)
PIN 1
IDEx
D/2
80
1
D
D1
D1/2
61
60
VIEW Y
E/2
B
B
e/2
X
VIEW Y
3 PLACES
b1
X=A, B, or D
PLATING
A
20
21
4X
0.200 C A–B D
E
E1
B
E1/2
41
40
D
4X
0.200 H A–B D
A2
A
A1
8X θ2
76X e
VIEW P
H
0.1 C
C
SEATING
PLANE
S
0.25
VIEW P
θ1
R (R1)
R (R2)
GAGE
θ
PLANE
(L2)
L
(L1)
c
c1
b
0.08 M C
A–B D
BASE
METAL
SECTION B–B
80 PLACES
ROTATED 90° CLOCKWISE
NOTES:
1. ALL DIMENSIONS AND TOLERANCES TO
CONFORM TO ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DATUM PLANE H IS COINCIDENT WITH THE
BOTTOM OF THE LEAD WHERE THE LEAD
EXITS THE PLASTIC BODY AT THE BOTTOM OF
THE PARTING LINE.
4. DATUMS A, B AND D TO BE DETERMINED AT
DATUM PLANE H.
5. DIMENSIONS D AND E TO BE DETERMINED AT
SEATING PLANE C.
6. DIMENSIONS D1 AND E1 DO NOT INCLUDE
MOLD PROTRUSION. ALLOWABLE
PROTRUSION IS 0.25 PER SIDE. DIMENSIONS
D1 AND E1 DO INCLUDE MOLD MISMATCH AND
ARE DETERMINED AT DATUM PLANE H.
7. DIMENSION b DOES NOT INCLUDE DAMBAR
PROTRUSION. THE DAMBAR PROTRUSION
SHALL NOT CAUSE THE b DIMENSION TO
EXCEED 0.35.
MILLIMETERS
DIM MIN MAX
A — 1.60
A1 0.05 0.15
A2 1.35 1.45
D 14.00 BSC
D1 12.00 BSC
E
14.00 BSC
E1 12.00 BSC
L 0.45 0.75
L1
1.00 REF
L2
0.50 REF
R1
0.20 REF
R2
0.20 REF
S
0.17 REF
b 0.17 0.27
b1 0.17 0.23
c 0.12 0.20
c1 0.12 0.16
e
0.50 BSC
θ 0°
7°
θ1 0°
—
θ2 10° 14°
Figure 25-3. 80-Pin Low-Profile Quad Flat Pack (Case No. 917)
Data Sheet
454
MC68HC908LJ24/LK24 — Rev. 2
Mechanical Specifications
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