RG82855GMESL72L Datasheet, PDF (211/213 Pages) Intel Corporation – Intel® 855GM/855GME Chipset Graphics and Memory Controller Hub (GMCH)

Ballout and Package Information
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11.1 Package Mechanical Information
Figure 14 through Figure 16 provide detail on the package information and dimensions of the
Intel 855GM/855GME GMCH. The Intel 855GM/855GME GMCH comes in a Micro-FCBGA
package, which is similar to the mobile processors. The package consists of a silicon die mounted
face down on an organic substrate populated with solder balls on the bottom side. Capacitors may
be placed in the area surrounding the die. Because the die-side capacitors are electrically
conductive, and only slightly shorter than the die height, care should be taken to avoid contacting
the capacitors with electrically conductive materials. Doing so may short the capacitors and
possibly damage the device or render it inactive.
The use of an insulating material between the capacitors and any thermal solution should be
considered to prevent capacitor shorting. An exclusion, or keepout area, surrounds the die and
capacitors, and identifies the contact area for the package. Care should be taken to avoid contact
with the package inside this area.
Figure 14. Intel^® 855GM/855GME GMCH Micro-FCBGA Package Dimensions (Top View)
Datasheet
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