MC68HC05JJ6 Datasheet, PDF (208/216 Pages) Freescale Semiconductor, Inc – General Release Specification Microcontrollers

Mechanical Specifications
14.3 20-Pin Plastic Dual In-Line Package (Case 738)
-A-
20
1
-T-
SEATING
PLANE
E
G
F
11
B
10
C
K
N
D 20 PL
0.25 (0.010) M T A M
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.
4. DIMENSION B DOES NOT INCLUDE MOLD
L
FLASH.
M
J 20 PL
0.25 (0.010) ^M T B ^M
INCHES
MILLIMETERS
DIM MIN MAX MIN MAX
A 1.010 1.070 25.66 27.17
B 0.240 0.260 6.10 6.60
C 0.150 0.180 3.81 4.57
D 0.015 0.022 0.39 0.55
E
0.050 BSC
1.27 BSC
F 0.050 0.070 1.27 1.77
G
0.100 BSC
2.54 BSC
J 0.008 0.015 0.21 0.38
K 0.110 0.140 2.80 3.55
L
0.300 BSC
7.62 BSC
M
0° 15° 0° 15°
N 0.020 0.040 0.51 1.01
14.4 20-Pin Small Outline Integrated Circuit (Case 751D)
-A-
20
11
-B- P 10 PL
0.010 (0.25) ^M B ^M
1
10
D 20 PL
J
0.010 (0.25) ^M T A S B S
F
C
-T-
SEATING
M
G 18 PL
K PLANE
R X 45°
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.150
(0.006) PER SIDE.
5. DIMENSION D DOES NOT INCLUDE
DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.13
(0.005) TOTAL IN EXCESS OF D DIMENSION
AT MAXIMUM MATERIAL CONDITION.
MILLIMETERS
INCHES
DIM MIN MAX MIN MAX
A 12.65 12.95 0.499 0.510
B 7.40 7.60 0.292 0.299
C 2.35 2.65 0.093 0.104
D 0.35 0.49 0.014 0.019
F 0.50 0.90 0.020 0.035
G
1.27 BSC
0.050 BSC
J 0.25 0.32 0.010 0.012
K 0.10 0.25 0.004 0.009
M
0°
7° 0°
7°
P 10.05 10.55 0.395 0.415
R 0.25 0.75 0.010 0.029
General Release Specification
208
MC68HC05JJ6/MC68HC05JP6 — Rev. 3.2
Mechanical Specifications
Freescale Semiconductor