MC68HC05JJ6 Datasheet, PDF (207/216 Pages) Freescale Semiconductor, Inc – General Release Specification Microcontrollers

General Release Specification — MC68HC05JJ6/MC68HC05JP6
Section 14. Mechanical Specifications
14.1 Contents
14.2 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .207
14.3 20-Pin Plastic Dual In-Line Package (Case 738) . . . . . . . . . .208
14.4 20-Pin Small Outline Integrated Circuit (Case 751D) . . . . . . .208
14.5 28-Pin Plastic Dual In-Line Package (Case 710) . . . . . . . . . .209
14.6 28-Pin Small Outline Integrated Circuit (Case 751F) . . . . . . .209
14.2 Introduction
The MC68HC05JJ6 is available in both a 20-pin plastic dual in-line
package (PDIP) and a small outline integrated circuit (SOIC) package.
The MC68HC05JP6 is available in a 28-pin plastic dual in-line package
(PDIP) and a 28-pin small outline integrated circuit (SOIC) package.
The following figure shows the latest package at the time of this
publication. To make sure that you have the latest package
specifications, please visit the Freescale website at http://freescale.com.
Follow wwweb on-line instructions to retrieve the current mechanical
specifications.
MC68HC05JJ6/MC68HC05JP6 — Rev. 3.2
Freescale Semiconductor
Mechanical Specifications
General Release Specification
207