HMC7044 Datasheet, PDF (69/72 Pages) Analog Devices – JESD204B clock generation

Data Sheet
EVALUATION PCB SCHEMATIC
EVALUATION PCB
For the circuit board used in the application, use RF circuit
design techniques. Ensure that signal lines have 50 Ω
impedance. Connect the package ground leads and exposed pad
directly to the ground plane (see Figure 52). Use a sufficient
number of via holes to connect the top and bottom ground
planes. The evaluation circuit board is available from Analog
Devices upon request.
The typical Pb-free reflow solder profile is shown in Figure 51.
HMC7044
RAMP UP
3°C/SECOND MAX
217°C
60 TO 150
SECONDS
260 – 5°C/260 + 0°C
150°C TO 200°C
RAMP DOWN
6°C/SECOND MAX
60 TO 180
SECONDS
480 SECONDS MAX
TIME (Second)
20 TO 40
SECONDS
Figure 51. Pb-Free Reflow Solder Profile
Figure 52. Evaluation PCB Layout, Top Side
Rev. B | Page 69 of 72