TLK6002 Datasheet, PDF (87/96 Pages) Texas Instruments – Dual Channel 0.47Gbps to 6.25Gbps Multi-Rate Transceiver

TLK6002
www.ti.com
SLLSE34 – MAY 2010
5 Appendix A – Application Board Supply Recommendations
Nominal Board Voltages Required: 1.0V, and either 1.5 or 1.8V
Ground - Connect all device grounds together on the application board (DGND, AGND)
1.0V – Bulk Decoupled
1. Ferrite Bead → DVDD (Locally Decoupled)
2. Ferrite Bead → AVDD / VDDT / VDDD (Locally Decoupled)
1.5V or 1.8V – Bulk Decoupled
1. Ferrite Bead → VDDQA/B (Locally Decoupled)
2. Ferrite Bead → VDDRA,VDDRB (Separate, Locally Decoupled)
3. Ferrite Bead → VDDO1,VDDO2,VDDO3 (Locally Decoupled)
VREF* can be generated using 1k resistors between VDDQA/B and DGND, and should be locally
decoupled.
Note: Ferrite beads should have high impedance near the fundamental frequency that the parallel data is
running at.
Note: Bulk decoupling prior to the ferrite beads required in order to decouple noise from power source.
This decoupling will be determined by your power source and what frequencies of noise it creates.
Note: For close to device localized decoupling (after ferrite beads), 1.0µF and 0.1µF caps should be
placed on the pins of the device on the back side of the board.
It is strongly recommended that TI review relevant pages of your application board schematics and layout
before fabrication to ensure first pass success.
Copyright © 2010, Texas Instruments Incorporated
Appendix A – Application Board Supply Recommendations
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