TLK6002 Datasheet, PDF (85/96 Pages) Texas Instruments – Dual Channel 0.47Gbps to 6.25Gbps Multi-Rate Transceiver

TLK6002
www.ti.com
SLLSE34 – MAY 2010
– If 2⁷-1 PRBS Pattern is desired:
• Write 3’b101 to 7.10:8 TEST_PATTERN_SEL[2:0]
– If 2²³-1 PRBS Pattern is desired:
• Write 3’b110 to 7.10:8 TEST_PATTERN_SEL[2:0]
• Final CDR Configuration
– Wait until either AGC_LOCKED asserted or 250M UI
– Write 8.9:8 (CDRFMULT[1:0]) = 2’b01
– Poll 5.13 AGC_LOCKED (1’b1) (per channel)
• Issue Data path Reset
– Write 1’b1 to 4.3 DATAPATH_RESET
• The pattern verification is now in progress.
• PRBSA_PASS contains a real time output that when low indicates the input PRBS pattern on RXAP/N
contains error.
• PRBSB_PASS contains a real time output that when low indicates the input PRBS pattern on RXBP/N
contains error.
• The following steps can be performed if the number of errors needs to be monitored:
– Read 14.15:0 ERROR_COUNTER[15:0] and discard the value.
– Read 14.15:0 ERROR_COUNTER[15:0], and verify 16’h0000 is read to confirm error free
operation. (as many times as desired during the duration of the test period)
4.20 PACKAGE DISSIPATION RATINGS
The following tables detail the thermal characteristics of the TLK6002 package.
Table 4-2. Package Thermal Characteristics
PARAMETER
q_JA
Theta-JA
q_JB
Theta-JB
q_JC
Theta-JC
Ψ_JT
Psi-JT
ΨJB
Psi-JB
JEDEC
STANDARD BOARD
VALUE
24.3
11.6
4.5
4.5
11.5
Note: Custom Typical Application Board Characteristics:
• 10 x 15 inches
• 12 layer
– 8 power/ground layers – 95% copper (1oz)
– 4 signal layers – 20% copper (1oz)
Ψ_JB = (T_J – T_B)/(Total Device Power Dissipation)
T_J = Device Junction Temperature
T_B = Temperature of PCB 1mm from device edge.
Ψ_JT = (T_J – T_C)/(Total Device Power Dissipation)
T_J = Device Junction Temperature
T_C = Hottest temperature on the case of the package
4.21 Device Total Worst Case Power Dissipation
The following table details the worst case total device power dissipation:
CUSTOM TYPICAL
APPLICATION BOARD
VALUE
19.2
11.6
4.5
4.5
11.3
Copyright © 2010, Texas Instruments Incorporated
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ELECTRICAL SPECIFICATIONS
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